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68 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
3,953
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 10 (2 x 5) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
2,990
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 10POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 10 (2 x 5) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,370
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
2,208
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
996
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
2,858
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 10POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 10 (2 x 5) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,166
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 10POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 10 (2 x 5) | Beryllium Copper | - | Brass | |||
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|
VIEW |
1,966
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 10POS GOLD | 614 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 10 (2 x 5) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,418
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 10POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 10 (2 x 5) | Beryllium Copper | - | Brass | |||
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|
VIEW |
3,339
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 10POS GOLD | 115 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 10 (2 x 5) | Beryllium Copper | - | Brass | |||
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|
VIEW |
3,960
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 10POS GOLD | 614 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 10 (2 x 5) | Beryllium Copper | - | Brass | |||
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|
VIEW |
2,884
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 10POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 10 (2 x 5) | Beryllium Copper | - | Brass | |||
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|
VIEW |
944
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 10POS GOLD | 115 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 10 (2 x 5) | Beryllium Copper | - | Brass | |||
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|
VIEW |
1,312
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
895
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
2,077
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
3,455
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
2,567
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
1,299
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,708
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
3,421
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
786
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
3,950
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,831
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
1,102
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
1,414
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,087
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,770
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,219
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,899
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
