Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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3,835
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Aries Electronics CONN SOCKET PGA GOLD PGM Obsolete Bulk -55°C ~ 105°C Through Hole Solder PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
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1,452
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Aries Electronics CONN SOCKET PGA GOLD PGM Obsolete Bulk -55°C ~ 105°C Through Hole Solder PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
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3,874
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Aries Electronics CONN SOCKET PGA TIN PGM Active Bulk -55°C ~ 105°C Through Hole Solder PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
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1,192
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Aries Electronics CONN SOCKET PGA TIN PGM Active Bulk -55°C ~ 105°C Through Hole Solder PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
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3,740
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Aries Electronics CONN SOCKET PGA TIN PGM Active Bulk -55°C ~ 105°C Through Hole Solder PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
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2,410
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Aries Electronics CONN SOCKET PGA TIN PGM Active Bulk -55°C ~ 105°C Through Hole Solder PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
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1,665
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Aries Electronics CONN SOCKET PGA TIN PGM Active Bulk -55°C ~ 105°C Through Hole Solder PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
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1,705
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Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 105°C Through Hole Solder PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
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3,599
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Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 105°C Through Hole Solder PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
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3,888
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Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 105°C Through Hole Solder PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
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2,886
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Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 105°C Through Hole Solder PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
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952
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Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 105°C Through Hole Solder PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
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1,436
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Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 105°C Through Hole Solder PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
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3,304
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Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 105°C Through Hole Solder PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
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3,077
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Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 105°C Through Hole Solder PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
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991
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Aries Electronics CONN SOCKET PGA TIN PGM Active Bulk -55°C ~ 105°C Through Hole Solder PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
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922
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Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 105°C Through Hole Solder PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
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3,285
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Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 105°C Through Hole Solder PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
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2,442
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Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 105°C Through Hole Solder PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
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3,540
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Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 105°C Through Hole Solder PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
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769
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Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 105°C Through Hole Solder PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
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2,623
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Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 105°C Through Hole Solder PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
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3,363
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Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 105°C Through Hole Solder PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
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1,937
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Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 105°C Through Hole Solder PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
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1,414
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Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 105°C Through Hole Solder PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
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3,264
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Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 105°C Through Hole Solder PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
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3,200
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Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 105°C Through Hole Solder PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
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2,596
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Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 105°C Through Hole Solder PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
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3,985
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Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 105°C Through Hole Solder PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
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3,121
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Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 105°C Through Hole Solder PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass