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15 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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VIEW |
3,408
In-stock
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 6 (2 x 3) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
2,911
In-stock
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 6 (2 x 3) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
2,522
In-stock
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 6 (2 x 3) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,836
In-stock
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 6 (2 x 3) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
2,491
In-stock
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 6 (2 x 3) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
3,056
In-stock
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 6 (2 x 3) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,804
In-stock
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 6 (2 x 3) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
1,551
In-stock
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 6 (2 x 3) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
3,521
In-stock
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 6 (2 x 3) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
1,782
In-stock
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 6 (2 x 3) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
3,616
In-stock
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 6 (2 x 3) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
921
In-stock
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 6 (2 x 3) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
2,280
In-stock
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 6 (2 x 3) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
3,996
In-stock
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 6 (2 x 3) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
2,938
In-stock
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CNC Tech | CONN IC DIP SOCKET 6POS GOLD | - | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 6 (2 x 3) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
