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Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
GLOBAL STOCKS
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RFQ
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RFQ
2,829
In-stock
TE Connectivity AMP Connectors CONN SOCKET PQFP 132POS TIN-LEAD - Active Tube - Through Hole Solder Closed Frame QFP Liquid Crystal Polymer (LCP) 0.025" (0.64mm) Tin-Lead 200.0µin (5.08µm) 132 (4 x 33) Phosphor Bronze
822064-4
RFQ
VIEW
RFQ
1,126
In-stock
TE Connectivity AMP Connectors CONN SOCKET PQFP 100POS TIN-LEAD - Obsolete Tube - Through Hole Solder Closed Frame QFP Liquid Crystal Polymer (LCP) 0.025" (0.64mm) Tin-Lead 200.0µin (5.08µm) 100 (4 x 25) Phosphor Bronze
C8140-04
RFQ
VIEW
RFQ
2,107
In-stock
Aries Electronics CONN IC DIP SOCKET 40POS TIN Edge-Grip™, C81 Obsolete Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 40 (2 x 20) Phosphor Bronze
C8128-04
RFQ
VIEW
RFQ
1,099
In-stock
Aries Electronics CONN IC DIP SOCKET 28POS TIN Edge-Grip™, C81 Obsolete Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 28 (2 x 14) Phosphor Bronze
C8124-04
RFQ
VIEW
RFQ
3,376
In-stock
Aries Electronics CONN IC DIP SOCKET 24POS TIN Edge-Grip™, C81 Obsolete Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 24 (2 x 12) Phosphor Bronze
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RFQ
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RFQ
2,250
In-stock
Aries Electronics CONN IC DIP SOCKET 22POS TIN Edge-Grip™, C81 Obsolete Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 22 (2 x 11) Phosphor Bronze
C8120-04
RFQ
VIEW
RFQ
1,887
In-stock
Aries Electronics CONN IC DIP SOCKET 20POS TIN Edge-Grip™, C81 Obsolete Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 20 (2 x 10) Phosphor Bronze
C8118-04
RFQ
VIEW
RFQ
1,624
In-stock
Aries Electronics CONN IC DIP SOCKET 18POS TIN Edge-Grip™, C81 Obsolete Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 18 (2 x 9) Phosphor Bronze
C8116-04
RFQ
VIEW
RFQ
3,753
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS TIN Edge-Grip™, C81 Obsolete Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 16 (2 x 8) Phosphor Bronze
C8114-04
RFQ
VIEW
RFQ
3,538
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN Edge-Grip™, C81 Obsolete Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze
C8108-04
RFQ
VIEW
RFQ
3,601
In-stock
Aries Electronics CONN IC DIP SOCKET 8POS TIN Edge-Grip™, C81 Obsolete Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 8 (2 x 4) Phosphor Bronze
2-821949-4
RFQ
VIEW
RFQ
1,524
In-stock
TE Connectivity AMP Connectors CONN SOCKET PQFP 100POS TIN-LEAD - Obsolete Tube - Through Hole Solder Closed Frame QFP Liquid Crystal Polymer (LCP) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) 100 (4 x 25) Phosphor Bronze
2-822114-3
RFQ
VIEW
RFQ
2,370
In-stock
TE Connectivity AMP Connectors CONN SOCKET PQFP 144POS TIN-LEAD - Obsolete Tube - Through Hole Solder Closed Frame QFP Liquid Crystal Polymer (LCP) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) 144 (4 x 36) Phosphor Bronze
2-821949-5
RFQ
VIEW
RFQ
1,094
In-stock
TE Connectivity AMP Connectors CONN SOCKET PQFP 132POS TIN-LEAD - Obsolete Tube - Through Hole Solder Closed Frame QFP Liquid Crystal Polymer (LCP) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) 132 (4 x 33) Phosphor Bronze
822114-3
RFQ
VIEW
RFQ
1,412
In-stock
TE Connectivity AMP Connectors CONN SOCKET PQFP 144POS TIN-LEAD - Obsolete Tube - Through Hole Solder Closed Frame QFP Liquid Crystal Polymer (LCP) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) 144 (4 x 36) Phosphor Bronze
822114-4
RFQ
VIEW
RFQ
1,436
In-stock
TE Connectivity AMP Connectors CONN SOCKET PQFP 160POS TIN-LEAD - Obsolete Tube - Through Hole Solder Closed Frame QFP Liquid Crystal Polymer (LCP) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) 160 (4 x 40) Phosphor Bronze
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RFQ
VIEW
RFQ
663
In-stock
Aries Electronics CONN IC DIP SOCKET 48POS TIN 6621 Active Bulk -55°C ~ 105°C Through Hole, Bottom Entry; Through Board Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 48 (2 x 24) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
1,260
In-stock
Aries Electronics CONN IC DIP SOCKET 34POS TIN 6621 Active Bulk -55°C ~ 105°C Through Hole, Bottom Entry; Through Board Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 34 (2 x 17) Phosphor Bronze
2-822114-4
RFQ
VIEW
RFQ
871
In-stock
TE Connectivity AMP Connectors CONN SOCKET PQFP 160POS TIN-LEAD - Active Tube - Through Hole Solder Closed Frame QFP Liquid Crystal Polymer (LCP) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) 160 (4 x 40) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
3,987
In-stock
TE Connectivity AMP Connectors CONN SOCKET PQFP 100POS TIN-LEAD - Obsolete Tube - Through Hole Solder Closed Frame QFP Liquid Crystal Polymer (LCP) 0.025" (0.64mm) Tin-Lead 200.0µin (5.08µm) 100 (4 x 25) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
1,518
In-stock
Aries Electronics CONN IC DIP SOCKET 40POS TIN 6621 Active Bulk -55°C ~ 105°C Through Hole, Bottom Entry; Through Board Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 40 (2 x 20) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
1,267
In-stock
Aries Electronics CONN IC DIP SOCKET 64POS GOLD 503 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 64 (2 x 32) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
3,004
In-stock
Aries Electronics CONN IC DIP SOCKET 64POS GOLD 503 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 64 (2 x 32) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
1,970
In-stock
Aries Electronics CONN IC DIP SOCKET 38POS TIN 6621 Active Bulk -55°C ~ 105°C Through Hole, Bottom Entry; Through Board Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 38 (2 x 19) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
2,321
In-stock
Aries Electronics CONN SOCKET SIP 39POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 39 (1 x 39) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
3,759
In-stock
Aries Electronics CONN IC DIP SOCKET 36POS TIN 6621 Active Bulk -55°C ~ 105°C Through Hole, Bottom Entry; Through Board Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 36 (2 x 18) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
1,249
In-stock
Aries Electronics CONN IC DIP SOCKET 48POS GOLD 503 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 48 (2 x 24) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
1,735
In-stock
Aries Electronics CONN IC DIP SOCKET 48POS GOLD 503 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 48 (2 x 24) Beryllium Copper
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RFQ
VIEW
RFQ
2,797
In-stock
Aries Electronics CONN IC DIP SOCKET 18POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 18 (2 x 9) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
3,326
In-stock
Aries Electronics CONN IC DIP SOCKET 18POS TIN Vertisockets™ 800 Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Tin 200.0µin (5.08µm) 18 (2 x 9) Phosphor Bronze