Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
C8140-04
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RFQ
2,107
In-stock
Aries Electronics CONN IC DIP SOCKET 40POS TIN Edge-Grip™, C81 Obsolete Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 40 (2 x 20) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
C8128-04
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RFQ
1,099
In-stock
Aries Electronics CONN IC DIP SOCKET 28POS TIN Edge-Grip™, C81 Obsolete Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 28 (2 x 14) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
C8124-04
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RFQ
3,376
In-stock
Aries Electronics CONN IC DIP SOCKET 24POS TIN Edge-Grip™, C81 Obsolete Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 24 (2 x 12) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
2,250
In-stock
Aries Electronics CONN IC DIP SOCKET 22POS TIN Edge-Grip™, C81 Obsolete Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 22 (2 x 11) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
C8120-04
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RFQ
1,887
In-stock
Aries Electronics CONN IC DIP SOCKET 20POS TIN Edge-Grip™, C81 Obsolete Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 20 (2 x 10) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
C8118-04
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RFQ
1,624
In-stock
Aries Electronics CONN IC DIP SOCKET 18POS TIN Edge-Grip™, C81 Obsolete Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 18 (2 x 9) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
C8116-04
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RFQ
3,753
In-stock
Aries Electronics CONN IC DIP SOCKET 16POS TIN Edge-Grip™, C81 Obsolete Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 16 (2 x 8) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
C8114-04
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RFQ
3,538
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS TIN Edge-Grip™, C81 Obsolete Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 14 (2 x 7) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
C8108-04
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RFQ
3,601
In-stock
Aries Electronics CONN IC DIP SOCKET 8POS TIN Edge-Grip™, C81 Obsolete Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 8 (2 x 4) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
986
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS GOLD Vertisockets™ 800 Obsolete Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
VIEW
RFQ
663
In-stock
Aries Electronics CONN IC DIP SOCKET 48POS TIN 6621 Active Bulk -55°C ~ 105°C Through Hole, Bottom Entry; Through Board Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 48 (2 x 24) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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VIEW
RFQ
1,260
In-stock
Aries Electronics CONN IC DIP SOCKET 34POS TIN 6621 Active Bulk -55°C ~ 105°C Through Hole, Bottom Entry; Through Board Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 34 (2 x 17) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
VIEW
RFQ
1,518
In-stock
Aries Electronics CONN IC DIP SOCKET 40POS TIN 6621 Active Bulk -55°C ~ 105°C Through Hole, Bottom Entry; Through Board Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 40 (2 x 20) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
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RFQ
2,254
In-stock
Aries Electronics CONN IC DIP SOCKET 48POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
VIEW
RFQ
3,472
In-stock
Aries Electronics CONN IC DIP SOCKET 48POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
VIEW
RFQ
2,243
In-stock
Aries Electronics CONN IC DIP SOCKET 48POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
VIEW
RFQ
1,373
In-stock
Aries Electronics CONN IC DIP SOCKET 32POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
VIEW
RFQ
2,238
In-stock
Aries Electronics CONN IC DIP SOCKET 32POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
VIEW
RFQ
3,500
In-stock
Aries Electronics CONN IC DIP SOCKET 32POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
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RFQ
3,167
In-stock
Aries Electronics CONN IC DIP SOCKET 32POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
VIEW
RFQ
2,607
In-stock
Aries Electronics CONN IC DIP SOCKET 32POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
VIEW
RFQ
1,433
In-stock
Aries Electronics CONN IC DIP SOCKET 32POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
VIEW
RFQ
3,471
In-stock
Aries Electronics CONN IC DIP SOCKET 40POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
VIEW
RFQ
3,216
In-stock
Aries Electronics CONN IC DIP SOCKET 40POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
VIEW
RFQ
2,539
In-stock
Aries Electronics CONN IC DIP SOCKET 40POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
VIEW
RFQ
2,257
In-stock
Aries Electronics CONN IC DIP SOCKET 40POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
VIEW
RFQ
3,221
In-stock
Aries Electronics CONN IC DIP SOCKET 40POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Surface Mount Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
VIEW
RFQ
894
In-stock
Aries Electronics CONN IC DIP SOCKET 40POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Surface Mount Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
VIEW
RFQ
1,267
In-stock
Aries Electronics CONN IC DIP SOCKET 64POS GOLD 503 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Phosphor Bronze
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RFQ
3,004
In-stock
Aries Electronics CONN IC DIP SOCKET 64POS GOLD 503 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Phosphor Bronze