Contact Finish - Mating :
Number of Positions or Pins (Grid) :
Contact Material - Post :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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3,252
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Aries Electronics CONN IC DIP SOCKET ZIF 28POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
ASU02DXTB
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1,081
In-stock
Sullins Connector Solutions CONN SOCKET AXIAL 2POS GOLD - Obsolete Bulk - Through Hole Solder Board Guide Axial - - Gold 10.0µin (0.25µm) Gold 2 (Rectangular) - 10.0µin (0.25µm) -
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RFQ
2,886
In-stock
Samtec Inc. CONN IC DIP SOCKET 28POS GOLD IC Obsolete Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Phosphor Bronze
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RFQ
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RFQ
3,837
In-stock
Samtec Inc. CONN IC DIP SOCKET 16POS GOLD IC Obsolete Bulk -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 16 (2 x 8) Beryllium Copper 10.0µin (0.25µm) Phosphor Bronze
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RFQ
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RFQ
2,641
In-stock
Aries Electronics CONN IC DIP SOCKET 14POS GOLD Lo-PRO®file, C93 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 14 (2 x 7) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
28-516-10
RFQ
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RFQ
2,644
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 28POS TIN 516 Obsolete Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 10.0µin (0.25µm) Tin 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
24-516-10
RFQ
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RFQ
1,927
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 24POS TIN 516 Obsolete Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 10.0µin (0.25µm) Tin 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
40-516-10
RFQ
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RFQ
3,434
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 40POS TIN 516 Obsolete Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 10.0µin (0.25µm) Tin 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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RFQ
VIEW
RFQ
689
In-stock
Preci-Dip BGA SURFACE MOUNT 1.27MM 558 Active Bulk -55°C ~ 125°C Surface Mount Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 652 (35 x 35) Brass 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
2,467
In-stock
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 652 (35 x 35) Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
1,785
In-stock
Preci-Dip BGA SURFACE MOUNT 1.27MM 558 Active Bulk -55°C ~ 125°C Surface Mount Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 600 (35 x 35) Brass 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
3,438
In-stock
Preci-Dip BGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 652 (35 x 35) Brass 10.0µin (0.25µm) Brass
Default Photo
RFQ
VIEW
RFQ
800
In-stock
Preci-Dip BGA SURFACE MOUNT 1.27MM 558 Active Bulk -55°C ~ 125°C Surface Mount Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 576 (30 x 30) Brass 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
3,345
In-stock
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 600 (35 x 35) Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
1,708
In-stock
Preci-Dip BGA SURFACE MOUNT 1.27MM 558 Active Bulk -55°C ~ 125°C Surface Mount Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 560 (33 x 33) Brass 10.0µin (0.25µm) Brass
Default Photo
RFQ
VIEW
RFQ
2,819
In-stock
Preci-Dip BGA SURFACE MOUNT 1.27MM 558 Active Bulk -55°C ~ 125°C Surface Mount Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 500 (30 x 30) Brass 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
604
In-stock
Preci-Dip BGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 560 (33 x 33) Brass 10.0µin (0.25µm) Brass
Default Photo
RFQ
VIEW
RFQ
2,836
In-stock
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 576 (30 x 30) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
RFQ
VIEW
RFQ
1,541
In-stock
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 520 (31 x 31) Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
1,316
In-stock
Preci-Dip BGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 600 (35 x 35) Brass 10.0µin (0.25µm) Brass
Default Photo
RFQ
VIEW
RFQ
3,268
In-stock
Preci-Dip BGA SURFACE MOUNT 1.27MM 558 Active Bulk -55°C ~ 125°C Surface Mount Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 480 (29 x 29) Brass 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
3,522
In-stock
Preci-Dip BGA SURFACE MOUNT 1.27MM 558 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 478 (26 x 26) Brass 10.0µin (0.25µm) Brass
Default Photo
RFQ
VIEW
RFQ
1,295
In-stock
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 560 (33 x 33) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
RFQ
VIEW
RFQ
1,927
In-stock
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 504 (29 x 29) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
RFQ
VIEW
RFQ
2,266
In-stock
Preci-Dip BGA SURFACE MOUNT 1.27MM 558 Active Bulk -55°C ~ 125°C Surface Mount Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 520 (31 x 31) Brass 10.0µin (0.25µm) Brass
Default Photo
RFQ
VIEW
RFQ
2,073
In-stock
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 500 (30 x 30) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
RFQ
VIEW
RFQ
706
In-stock
Preci-Dip BGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 576 (30 x 30) Brass 10.0µin (0.25µm) Brass
Default Photo
RFQ
VIEW
RFQ
3,322
In-stock
Preci-Dip BGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 520 (31 x 31) Brass 10.0µin (0.25µm) Brass
Default Photo
RFQ
VIEW
RFQ
3,974
In-stock
Preci-Dip BGA SURFACE MOUNT 1.27MM 558 Active Bulk -55°C ~ 125°C Surface Mount Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 504 (29 x 29) Brass 10.0µin (0.25µm) Brass
Default Photo
RFQ
VIEW
RFQ
3,375
In-stock
Preci-Dip BGA SURFACE MOUNT 1.27MM 558 Active Bulk -55°C ~ 125°C Surface Mount Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 456 (26 x 26) Brass 10.0µin (0.25µm) Brass