Contact Finish - Post :
Contact Finish Thickness - Post :
Contact Material - Post :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
Default Photo
RFQ
VIEW
RFQ
1,802
In-stock
Harwin Inc. CONN SOCKET SIP 32POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 32 (1 x 32) Beryllium Copper - Brass
Default Photo
RFQ
VIEW
RFQ
2,149
In-stock
Harwin Inc. CONN SOCKET SIP 20POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 20 (1 x 20) Beryllium Copper - Brass
Default Photo
RFQ
VIEW
RFQ
1,231
In-stock
Harwin Inc. CONN SOCKET SIP 18POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 18 (1 x 18) Beryllium Copper - Brass
Default Photo
RFQ
VIEW
RFQ
3,042
In-stock
Harwin Inc. CONN SOCKET SIP 16POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 16 (1 x 16) Beryllium Copper - Brass
Default Photo
RFQ
VIEW
RFQ
1,236
In-stock
Harwin Inc. CONN SOCKET SIP 14POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 14 (1 x 14) Beryllium Copper - Brass
Default Photo
RFQ
VIEW
RFQ
3,973
In-stock
Harwin Inc. CONN SOCKET SIP 12POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 12 (1 x 12) Beryllium Copper - Brass
Default Photo
RFQ
VIEW
RFQ
3,521
In-stock
Harwin Inc. CONN SOCKET SIP 10POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 10 (1 x 10) Beryllium Copper - Brass
Default Photo
RFQ
VIEW
RFQ
1,362
In-stock
Harwin Inc. CONN SOCKET SIP 9POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 9 (1 x 9) Beryllium Copper - Brass
Default Photo
RFQ
VIEW
RFQ
3,194
In-stock
Harwin Inc. CONN SOCKET SIP 8POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 8 (1 x 8) Beryllium Copper - Brass
Default Photo
RFQ
VIEW
RFQ
1,684
In-stock
Harwin Inc. CONN SOCKET SIP 7POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 7 (1 x 7) Beryllium Copper - Brass
Default Photo
RFQ
VIEW
RFQ
2,955
In-stock
Harwin Inc. CONN SOCKET SIP 6POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 6 (1 x 6) Beryllium Copper - Brass
Default Photo
RFQ
VIEW
RFQ
2,665
In-stock
Harwin Inc. CONN SOCKET SIP 5POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 5 (1 x 5) Beryllium Copper - Brass
Default Photo
RFQ
VIEW
RFQ
1,164
In-stock
Harwin Inc. CONN SOCKET SIP 4POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 4 (1 x 4) Beryllium Copper - Brass
Default Photo
RFQ
VIEW
RFQ
750
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 64POS GOLD 324 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 64 (1 x 64) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
1,852
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 64POS GOLD 321 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 64 (1 x 64) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
1,791
In-stock
Aries Electronics CONN SOCKET SIP 38POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 38 (1 x 38) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
1,305
In-stock
Aries Electronics CONN SOCKET SIP 38POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 38 (1 x 38) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
2,685
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 64POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 64 (1 x 64) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
650
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 32POS GOLD 324 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
1,924
In-stock
Omron Electronics Inc-EMC Div CONN SOCKET SIP 32POS GOLD XR2 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Carrier SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Gold 32 (1 x 32) Beryllium Copper 29.5µin (0.75µm) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
2,076
In-stock
Omron Electronics Inc-EMC Div CONN SOCKET SIP 32POS GOLD XR2 Obsolete Bulk -55°C ~ 125°C - Solder - SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold - Gold 32 (1 x 32) Beryllium Copper - Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
2,348
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 64POS GOLD 326 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 64 (1 x 64) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
847
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 5POS TIN - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Tin 196.9µin (5.00µm) Tin 5 (1 x 5) Beryllium Copper 196.9µin (5.00µm) Brass
Default Photo
RFQ
VIEW
RFQ
2,332
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 64POS GOLD - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold Flash Gold 64 (1 x 64) Beryllium Copper Flash Brass
Default Photo
RFQ
VIEW
RFQ
3,960
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 64POS TIN - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Tin 196.9µin (5.00µm) Tin 64 (1 x 64) Beryllium Copper 196.9µin (5.00µm) Brass
Default Photo
RFQ
VIEW
RFQ
791
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 64POS GOLD - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 29.5µin (0.75µm) Gold 64 (1 x 64) Beryllium Copper 29.5µin (0.75µm) Brass
Default Photo
RFQ
VIEW
RFQ
2,563
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 32POS TIN - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Tin 196.9µin (5.00µm) Tin 32 (1 x 32) Beryllium Copper 196.9µin (5.00µm) Brass
Default Photo
RFQ
VIEW
RFQ
1,980
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 20POS GOLD - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 29.5µin (0.75µm) Gold 20 (1 x 20) Beryllium Copper 29.5µin (0.75µm) Brass
Default Photo
RFQ
VIEW
RFQ
3,946
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 4POS GOLD - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 29.5µin (0.75µm) Gold 4 (1 x 4) Beryllium Copper 29.5µin (0.75µm) Brass
Default Photo
RFQ
VIEW
RFQ
3,562
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 32POS GOLD - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 29.5µin (0.75µm) Gold 32 (1 x 32) Beryllium Copper 29.5µin (0.75µm) Brass