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11 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
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VIEW |
2,339
In-stock
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Amphenol FCI | CONN SOCKET SIP 30POS TIN | SIP050-1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 30 (1 x 30) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
688
In-stock
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Amphenol FCI | CONN SOCKET SIP 30POS GOLD | SIP050-1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 30 (1 x 30) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,885
In-stock
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Amphenol FCI | CONN SOCKET SIP 30POS GOLD | SIP1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 30 (1 x 30) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
2,666
In-stock
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Aries Electronics | CONN SOCKET SIP 30POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 30 (1 x 30) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,995
In-stock
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Aries Electronics | CONN SOCKET SIP 30POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 30 (1 x 30) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,356
In-stock
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Aries Electronics | CONN SOCKET SIP 30POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 30 (1 x 30) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,323
In-stock
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Aries Electronics | CONN SOCKET SIP 30POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 30 (1 x 30) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
1,185
In-stock
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Aries Electronics | CONN SOCKET SIP 30POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 30 (1 x 30) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,820
In-stock
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Mill-Max Manufacturing Corp. | CONN SOCKET SIP 30POS GOLD | 346 | Active | Bulk | -55°C ~ 125°C | Through Hole | Press-Fit | - | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 30 (1 x 30) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
VIEW |
1,003
In-stock
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Mill-Max Manufacturing Corp. | CONN SOCKET SIP 30POS GOLD | 346 | Active | Bulk | -55°C ~ 125°C | Through Hole | Press-Fit | - | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 30 (1 x 30) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
VIEW |
3,388
In-stock
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Aries Electronics | CONN SOCKET SIP 30POS GOLD | 518 | Active | Bulk | - | Surface Mount | Solder | Open Frame | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 30 (1 x 30) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
