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87 results
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
GLOBAL STOCKS
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28-6553-18
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RFQ
3,707
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper Beryllium Copper
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32-6574-16
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RFQ
3,991
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper Beryllium Copper
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32-6575-11
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RFQ
1,128
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper Beryllium Copper
Default Photo
32-6573-11
RFQ
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RFQ
3,529
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper Beryllium Copper
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32-6556-40
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RFQ
2,946
In-stock
 Aries Electronics CONN IC DIP SOCKET 32POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper Brass
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32-6575-16
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RFQ
3,813
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper Beryllium Copper
Default Photo
32-6573-16
RFQ
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RFQ
2,770
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper Beryllium Copper
Default Photo
32-6572-16
RFQ
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RFQ
3,516
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper Beryllium Copper
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32-C300-30
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RFQ
1,373
In-stock
 Aries Electronics CONN IC DIP SOCKET 32POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper Brass
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32-C300-20
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RFQ
2,238
In-stock
 Aries Electronics CONN IC DIP SOCKET 32POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper Brass
Default Photo
32-C212-30
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RFQ
3,500
In-stock
 Aries Electronics CONN IC DIP SOCKET 32POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper Brass
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32-C212-20
RFQ
VIEW
RFQ
3,167
In-stock
 Aries Electronics CONN IC DIP SOCKET 32POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper Brass
Default Photo
32-C182-30
RFQ
VIEW
RFQ
2,607
In-stock
 Aries Electronics CONN IC DIP SOCKET 32POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper Brass
Default Photo
32-C182-20
RFQ
VIEW
RFQ
1,433
In-stock
 Aries Electronics CONN IC DIP SOCKET 32POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper Brass
Default Photo
32-6575-18
RFQ
VIEW
RFQ
2,544
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper Beryllium Copper
Default Photo
32-6574-18
RFQ
VIEW
RFQ
848
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper Beryllium Copper
Default Photo
32-6556-30
RFQ
VIEW
RFQ
3,683
In-stock
 Aries Electronics CONN IC DIP SOCKET 32POS GOLD 6556 Active Bulk - Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper Brass
Default Photo
32-6556-20
RFQ
VIEW
RFQ
2,200
In-stock
 Aries Electronics CONN IC DIP SOCKET 32POS GOLD 6556 Active Bulk - Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper Brass
Default Photo
32-6508-302
RFQ
VIEW
RFQ
1,179
In-stock
 Aries Electronics CONN IC DIP SOCKET 32POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper Brass
Default Photo
32-6508-202
RFQ
VIEW
RFQ
681
In-stock
 Aries Electronics CONN IC DIP SOCKET 32POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper Brass
Default Photo
32-6823-90C
RFQ
VIEW
RFQ
611
In-stock
 Aries Electronics CONN IC DIP SOCKET 32POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper Brass
Default Photo
32-6822-90C
RFQ
VIEW
RFQ
2,128
In-stock
 Aries Electronics CONN IC DIP SOCKET 32POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper Brass
Default Photo
32-6820-90C
RFQ
VIEW
RFQ
1,060
In-stock
 Aries Electronics CONN IC DIP SOCKET 32POS GOLD Vertisockets™ 800 Active Bulk -55°C ~ 105°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper Brass
Default Photo
32-3573-10
RFQ
VIEW
RFQ
2,609
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper Beryllium Copper
Default Photo
32-3572-10
RFQ
VIEW
RFQ
965
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper Beryllium Copper
Default Photo
32-3571-10
RFQ
VIEW
RFQ
1,607
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper Beryllium Copper
Default Photo
32-3570-10
RFQ
VIEW
RFQ
668
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper Beryllium Copper
Default Photo
32-3554-10
RFQ
VIEW
RFQ
2,034
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper Beryllium Copper
Default Photo
32-3503-30
RFQ
VIEW
RFQ
2,622
In-stock
 Aries Electronics CONN IC DIP SOCKET 32POS GOLD 503 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper Phosphor Bronze
Default Photo
32-3503-20
RFQ
VIEW
RFQ
3,470
In-stock
 Aries Electronics CONN IC DIP SOCKET 32POS GOLD 503 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper Phosphor Bronze
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