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86 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GLOBAL STOCKS | |||||||||||||||||||||||
VIEW |
3,115
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 8POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | ||||
VIEW |
2,399
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 8POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | - | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | ||||
VIEW |
1,478
In-stock
|
Amphenol FCI | CONN IC DIP SOCKET 8POS TIN-LEAD | DPF3 | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
3,175
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 8POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | ||||
VIEW |
3,703
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 8POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | ||||
VIEW |
1,769
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | Correct-A-Chip® 1109800 | Active | Bulk | - | Through Hole | Solder | Programmable | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
1,294
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 8POS GOLD | 126 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | ||||
VIEW |
3,700
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 8POS GOLD | 126 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | ||||
VIEW |
2,235
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 8POS GOLD | 126 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | ||||
VIEW |
3,623
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 8POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | ||||
VIEW |
1,309
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 8POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | ||||
VIEW |
1,414
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 8POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | ||||
VIEW |
3,952
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 8POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | ||||
VIEW |
2,839
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 8POS TIN-LEAD | 210 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | ||||
VIEW |
633
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 8POS GOLD | 614 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | ||||
VIEW |
3,027
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 8POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | ||||
VIEW |
2,366
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
3,069
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
1,421
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
3,988
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
1,253
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 8POS GOLD | 101 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | ||||
VIEW |
1,026
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
687
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 8POS GOLD | 114 | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | ||||
VIEW |
635
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 8POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | ||||
VIEW |
1,119
In-stock
|
CNC Tech | CONN IC DIP SOCKET 8POS GOLD | - | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
3,977
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 8POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | ||||
VIEW |
1,186
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 8POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | ||||
VIEW |
2,653
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 8POS GOLD | 115 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | ||||
VIEW |
3,188
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 8POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | ||||
VIEW |
1,451
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 8POS GOLD | 123 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy |