Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
GLOBAL STOCKS
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3,966
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Amphenol FCI CONN SOCKET SIP 20POS TIN SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 20 (1 x 20) Beryllium Copper Brass
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3,583
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Amphenol FCI CONN SOCKET SIP 20POS GOLD SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 20 (1 x 20) Beryllium Copper Brass
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673
In-stock
Amphenol FCI CONN SOCKET SIP 20POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 20 (1 x 20) Beryllium Copper Brass
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2,304
In-stock
Amphenol FCI CONN SOCKET SIP 20POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 20 (1 x 20) Beryllium Copper Brass
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2,459
In-stock
Amphenol FCI CONN SOCKET SIP 20POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (1 x 20) Beryllium Copper Brass
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1,197
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Aries Electronics CONN SOCKET SIP 20POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 20 (1 x 20) Beryllium Copper Brass
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3,097
In-stock
Aries Electronics CONN SOCKET SIP 20POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 20 (1 x 20) Beryllium Copper Brass
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2,373
In-stock
Aries Electronics CONN SOCKET SIP 20POS GOLD 0517 Active Bulk - Through Hole, Right Angle Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled - Gold 30.0µin (0.76µm) Tin 20 (1 x 20) Beryllium Copper Brass
346-43-120-41-013000
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3,988
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 20POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 20 (1 x 20) Beryllium Copper Brass Alloy
346-93-120-41-013000
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RFQ
1,970
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 20POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (1 x 20) Beryllium Copper Brass Alloy
714-93-120-31-018000
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1,331
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 20POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (1 x 20) Beryllium Copper Brass Alloy
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3,244
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Aries Electronics CONN SOCKET SIP 20POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (1 x 20) Beryllium Copper Brass
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1,900
In-stock
Aries Electronics CONN SOCKET SIP 20POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (1 x 20) Beryllium Copper Brass
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835
In-stock
Aries Electronics CONN SOCKET SIP 20POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (1 x 20) Beryllium Copper Brass
20-0518-00
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2,562
In-stock
Aries Electronics CONN SOCKET SIP 20POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (1 x 20) Beryllium Copper Brass
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2,364
In-stock
Aries Electronics CONN SOCKET SIP 20POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (1 x 20) Beryllium Copper Brass
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981
In-stock
Aries Electronics CONN SOCKET SIP 20POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (1 x 20) Beryllium Copper Brass
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1,299
In-stock
Aries Electronics CONN SOCKET SIP 20POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (1 x 20) Beryllium Copper Brass
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2,631
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 20POS GOLD 310 Active Tube -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 20 (1 x 20) Beryllium Copper Brass Alloy
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1,591
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Assmann WSW Components SOCKET 20 CONTACTS SINGLE ROW - Active - -40°C ~ 105°C Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold Flash Tin 20 (1 x 20) Beryllium Copper Brass
20-0518-10T
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3,474
In-stock
Aries Electronics CONN SOCKET SIP 20POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (1 x 20) Beryllium Copper Brass
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1,429
In-stock
Aries Electronics CONN SOCKET SIP 20POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (1 x 20) Beryllium Copper Brass
MS06
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1,262
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Apex Microtechnology CONN SOCKET SIP 20POS GOLD Apex Precision Power® Active Bulk - Through Hole Solder Closed Frame SIP Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 20 (1 x 20) Beryllium Copper Brass
346-99-120-41-013000
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RFQ
1,084
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 20POS TIN-LEAD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 20 (1 x 20) Beryllium Copper Brass Alloy