- Manufacture :
- Series :
- Part Status :
- Termination :
- Features :
- Number of Positions or Pins (Grid) :
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- 10 (1 x 10) (2)
- 14 (1 x 14) (1)
- 16 (1 x 16) (1)
- 17 (1 x 17) (1)
- 2 (1 x 2) (2)
- 20 (1 x 20) (2)
- 24 (2 x 12) (4)
- 27 (1 x 27) (1)
- 28 (2 x 14) (4)
- 30 (1 x 30) (1)
- 32 (1 x 32) (2)
- 32 (2 x 16) (4)
- 36 (2 x 18) (4)
- 40 (2 x 20) (3)
- 42 (2 x 21) (4)
- 44 (2 x 22) (4)
- 48 (2 x 24) (3)
- 5 (1 x 5) (1)
- 6 (1 x 6) (1)
- 8 (1 x 8) (1)
- 9 (1 x 9) (1)
- Applied Filters :
47 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
3,094
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,964
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,050
In-stock
|
Amphenol FCI | CONN SOCKET SIP 2POS GOLD | SIP1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 2 (1 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,421
In-stock
|
Amphenol FCI | CONN SOCKET SIP 16POS GOLD | SIP1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 16 (1 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
2,212
In-stock
|
Amphenol FCI | CONN SOCKET SIP 10POS GOLD | SIP1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 10 (1 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,885
In-stock
|
Amphenol FCI | CONN SOCKET SIP 30POS GOLD | SIP1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 30 (1 x 30) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,609
In-stock
|
Amphenol FCI | CONN SOCKET SIP 14POS GOLD | SIP1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 14 (1 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,374
In-stock
|
Amphenol FCI | CONN SOCKET SIP 5POS GOLD | SIP1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 5 (1 x 5) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,942
In-stock
|
Amphenol FCI | CONN SOCKET SIP 32POS GOLD | SIP1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 32 (1 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
673
In-stock
|
Amphenol FCI | CONN SOCKET SIP 20POS GOLD | SIP1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 20 (1 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
2,947
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 44POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
2,304
In-stock
|
Amphenol FCI | CONN SOCKET SIP 20POS GOLD | SIP1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 20 (1 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,468
In-stock
|
Amphenol FCI | CONN SOCKET SIP 17POS GOLD | SIP1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 17 (1 x 17) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,640
In-stock
|
Amphenol FCI | CONN SOCKET SIP 2POS GOLD | SIP1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 2 (1 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,087
In-stock
|
Amphenol FCI | CONN SOCKET SIP 10POS GOLD | SIP1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 10 (1 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
2,102
In-stock
|
Amphenol FCI | CONN SOCKET SIP 32POS GOLD | SIP1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 32 (1 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,458
In-stock
|
Amphenol FCI | CONN SOCKET SIP 27POS GOLD | SIP1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 27 (1 x 27) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,016
In-stock
|
Amphenol FCI | CONN SOCKET SIP 9POS GOLD | SIP1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 9 (1 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
2,182
In-stock
|
Amphenol FCI | CONN SOCKET SIP 6POS GOLD | SIP1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 6 (1 x 6) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
2,343
In-stock
|
Amphenol FCI | CONN SOCKET SIP 8POS GOLD | SIP1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 8 (1 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,308
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 36 (2 x 18) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,755
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
2,946
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,224
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
2,249
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 42POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 42 (2 x 21) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,683
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | 6556 | Active | Bulk | - | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
2,200
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | 6556 | Active | Bulk | - | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,146
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 42POS GOLD | 6556 | Active | Bulk | - | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 42 (2 x 21) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
2,328
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 42POS GOLD | 6556 | Active | Bulk | - | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 42 (2 x 21) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,168
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Brass |