Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
AR08-HZL-TT
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RFQ
3,115
In-stock
Assmann WSW Components CONN IC DIP SOCKET 8POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR08-HZW/T
RFQ
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RFQ
2,399
In-stock
Assmann WSW Components CONN IC DIP SOCKET 8POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold - 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR08-HZL/07-TT
RFQ
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RFQ
3,175
In-stock
Assmann WSW Components CONN IC DIP SOCKET 8POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR08-HZL/01-TT
RFQ
VIEW
RFQ
3,703
In-stock
Assmann WSW Components CONN IC DIP SOCKET 8POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
1814640-8
RFQ
VIEW
RFQ
729
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS TIN - Active Tape & Reel (TR) -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin 200.0µin (5.08µm) 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Brass
AR 08 HZL/07-TT
RFQ
VIEW
RFQ
3,762
In-stock
Assmann WSW Components CONN IC DIP SOCKET 8POS GOLD - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR 08 HZL/01-TT
RFQ
VIEW
RFQ
3,431
In-stock
Assmann WSW Components CONN IC DIP SOCKET 8POS GOLD - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR 08 HZW/TN
RFQ
VIEW
RFQ
1,822
In-stock
Assmann WSW Components CONN IC DIP SOCKET 8POS GOLD - Active Tube -40°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold - 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR 08 HZL-TT
RFQ
VIEW
RFQ
1,173
In-stock
Assmann WSW Components CONN IC DIP SOCKET 8POS TIN - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper