Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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3,096
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 36POS GOLD 126 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 36 (2 x 18) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,069
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 36POS GOLD 126 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 36 (2 x 18) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,492
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 36POS GOLD 124 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 36 (2 x 18) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,601
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 36POS GOLD 126 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 36 (2 x 18) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,169
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Aries Electronics CONN IC DIP SOCKET 36POS GOLD 6556 Active Bulk - Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 36 (2 x 18) Beryllium Copper 200.0µin (5.08µm) Brass
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2,316
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Aries Electronics CONN IC DIP SOCKET 36POS GOLD 6556 Active Bulk - Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 36 (2 x 18) Beryllium Copper 200.0µin (5.08µm) Brass
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3,594
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 36POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 36 (2 x 18) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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650
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Aries Electronics CONN IC DIP SOCKET 36POS GOLD 503 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 36 (2 x 18) Beryllium Copper 200.0µin (5.08µm) Phosphor Bronze
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3,053
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Aries Electronics CONN IC DIP SOCKET 36POS GOLD 503 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 36 (2 x 18) Beryllium Copper 200.0µin (5.08µm) Phosphor Bronze
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781
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Aries Electronics CONN IC DIP SOCKET 36POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 36 (2 x 18) Beryllium Copper 200.0µin (5.08µm) Brass
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694
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Aries Electronics CONN IC DIP SOCKET 36POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 36 (2 x 18) Beryllium Copper 200.0µin (5.08µm) Brass
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2,778
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Aries Electronics CONN IC DIP SOCKET 36POS GOLD 503 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 36 (2 x 18) Beryllium Copper 200.0µin (5.08µm) Phosphor Bronze
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2,394
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Aries Electronics CONN IC DIP SOCKET 36POS GOLD 503 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 36 (2 x 18) Beryllium Copper 200.0µin (5.08µm) Phosphor Bronze