Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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2,450
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 48POS GOLD 126 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,431
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 48POS GOLD 127 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin-Lead 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,610
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 48POS GOLD 127 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin-Lead 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,337
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 48POS GOLD 124 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,058
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 48POS GOLD 126 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
123-43-648-41-001000
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3,356
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 48POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,249
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Aries Electronics CONN IC DIP SOCKET 48POS GOLD 503 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Phosphor Bronze
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1,735
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Aries Electronics CONN IC DIP SOCKET 48POS GOLD 503 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Phosphor Bronze
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2,918
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 48POS GOLD 127 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin-Lead 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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800
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 48POS GOLD 127 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin-Lead 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,878
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Aries Electronics CONN IC DIP SOCKET 48POS GOLD 6556 Active Bulk - Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Brass
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929
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 48POS GOLD 126 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
123-93-648-41-001000
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1,513
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 48POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,770
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Aries Electronics CONN IC DIP SOCKET 48POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Brass
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1,618
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Aries Electronics CONN IC DIP SOCKET 48POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Brass