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23 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
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VIEW |
2,215
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 14POS GOLD | 124 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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VIEW |
1,113
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 14POS GOLD | 126 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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VIEW |
1,806
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 14POS GOLD | 126 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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VIEW |
3,984
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,972
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,710
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,757
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
703
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 14POS GOLD | 126 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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VIEW |
3,380
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,351
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
731
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 14POS GOLD | 123 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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VIEW |
3,576
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,890
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
1,511
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
1,261
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
1,707
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
3,568
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 14POS GOLD | 123 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame, Decoupling Capacitor | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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VIEW |
3,052
In-stock
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Assmann WSW Components | CONN IC DIP SOCKET 14POS GOLD | - | Active | Tube | -40°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | - | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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VIEW |
2,317
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 14POS GOLD | 123 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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VIEW |
2,374
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,632
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
2,507
In-stock
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CNC Tech | CONN IC DIP SOCKET 14POS GOLD | - | Active | Tube | -55°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT) | 0.100" (2.54mm) | Gold | - | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
798
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 14POS GOLD | 123 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame, Decoupling Capacitor | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
