Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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1,937
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS TIN - Obsolete Tape & Reel (TR) -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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2,974
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Aries Electronics CONN SOCKET SIP 2POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 2 (1 x 2) Beryllium Copper 200.0µin (5.08µm) Brass
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3,460
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Aries Electronics CONN SOCKET SIP 34POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 34 (1 x 34) Beryllium Copper 200.0µin (5.08µm) Brass
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3,342
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Aries Electronics CONN SOCKET SIP 33POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 33 (1 x 33) Beryllium Copper 200.0µin (5.08µm) Brass
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1,433
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Aries Electronics CONN SOCKET SIP 23POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 23 (1 x 23) Beryllium Copper 200.0µin (5.08µm) Brass
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2,664
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Aries Electronics CONN SOCKET SIP 22POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 22 (1 x 22) Beryllium Copper 200.0µin (5.08µm) Brass
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1,130
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS TIN - Active Tape & Reel (TR) -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
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2,258
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Aries Electronics CONN SOCKET SIP 15POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 15 (1 x 15) Beryllium Copper 200.0µin (5.08µm) Brass
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1,755
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Aries Electronics CONN SOCKET SIP 14POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (1 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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3,000
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Aries Electronics CONN SOCKET SIP 9POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 9 (1 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
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2,148
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CNC Tech CONN IC DIP SOCKET 48POS GOLD - Active Tube -40°C ~ 105°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT) 0.100" (2.54mm) Gold - Tin 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Brass
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1,734
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Aries Electronics CONN SOCKET SIP 8POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 8 (1 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
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3,593
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Aries Electronics CONN SOCKET SIP 37POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 37 (1 x 37) Beryllium Copper 200.0µin (5.08µm) Brass
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3,924
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Aries Electronics CONN SOCKET SIP 36POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 36 (1 x 36) Beryllium Copper 200.0µin (5.08µm) Brass
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2,219
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Aries Electronics CONN SOCKET SIP 35POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 35 (1 x 35) Beryllium Copper 200.0µin (5.08µm) Brass
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3,610
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CNC Tech CONN IC DIP SOCKET 20POS GOLD - Active Tube -40°C ~ 105°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT) 0.100" (2.54mm) Gold - Tin 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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1,055
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Aries Electronics CONN SOCKET SIP 4POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 4 (1 x 4) Beryllium Copper 200.0µin (5.08µm) Brass
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3,530
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CNC Tech CONN IC DIP SOCKET 18POS GOLD - Active Tube -40°C ~ 105°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT) 0.100" (2.54mm) Gold - Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
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736
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CNC Tech CONN IC DIP SOCKET 16POS GOLD - Active Tube -40°C ~ 105°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT) 0.100" (2.54mm) Gold - Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
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648
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CNC Tech CONN IC DIP SOCKET 14POS GOLD - Active Tube -40°C ~ 105°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT) 0.100" (2.54mm) Gold - Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
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3,323
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Aries Electronics CONN SOCKET SIP 3POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 3 (1 x 3) Beryllium Copper 200.0µin (5.08µm) Brass
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3,709
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Aries Electronics CONN SOCKET SIP 1POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 1 (1 x 1) Beryllium Copper 200.0µin (5.08µm) Brass
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2,517
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Aries Electronics CONN SOCKET SIP 39POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 39 (1 x 39) Beryllium Copper 200.0µin (5.08µm) Brass
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763
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Aries Electronics CONN SOCKET SIP 25POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 25 (1 x 25) Beryllium Copper 200.0µin (5.08µm) Brass
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2,077
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Aries Electronics CONN SOCKET SIP 24POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (1 x 24) Beryllium Copper 200.0µin (5.08µm) Brass
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2,269
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Aries Electronics CONN SOCKET SIP 40POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (1 x 40) Beryllium Copper 200.0µin (5.08µm) Brass
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1,997
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Aries Electronics CONN SOCKET SIP 38POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 38 (1 x 38) Beryllium Copper 200.0µin (5.08µm) Brass
20-0518-00
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2,562
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Aries Electronics CONN SOCKET SIP 20POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (1 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
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3,592
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Aries Electronics CONN SOCKET SIP 27POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 27 (1 x 27) Beryllium Copper 200.0µin (5.08µm) Brass
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809
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Aries Electronics CONN SOCKET SIP 17POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 17 (1 x 17) Beryllium Copper 200.0µin (5.08µm) Brass