- Series :
-
- 0503 (49)
- 0513 (76)
- 317 (4)
- 323 (1)
- 324 (2)
- 326 (1)
- 346 (132)
- 410 (3)
- 503 (92)
- 508 (197)
- 511 (1)
- 518 (342)
- 522 (1)
- 55 (62)
- 57 (183)
- 6556 (30)
- 714 (3)
- Apex Precision Power® (3)
- Correct-A-Chip® 1109800 (11)
- EJECT-A-DIP™ (52)
- Lo-PRO®file, 513 (147)
- OEM (1)
- PG (2)
- PGG (1)
- PGM (74)
- PLS (71)
- PRL (2)
- PRS (110)
- SIP050-1x (61)
- SIP1x (44)
- Part Status :
- Operating Temperature :
- Termination :
- Type :
-
- DIP, 0.2" (5.08mm) Row Spacing (142)
- DIP, 0.3" (7.62mm) Row Spacing (225)
- DIP, 0.4" (10.16mm) Row Spacing (36)
- DIP, 0.6" (15.24mm) Row Spacing (211)
- DIP, 0.9" (22.86mm) Row Spacing (56)
- DIP, 1.2" (30.48mm) Row Spacing (1)
- DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing (103)
- DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing (142)
- PGA (80)
- PGA, ZIF (ZIP) (184)
- QFP (1)
- SIP (575)
- Transistor, TO-3 (2)
- Zig-Zag, Left Stackable (2)
- Zig-Zag, Right Stackable (1)
- Housing Material :
-
- Polyamide (PA), Nylon, Glass Filled (49)
- Polyamide (PA46), Nylon 4/6 (121)
- Polyamide (PA46), Nylon 4/6, Glass Filled (872)
- Polybutylene Terephthalate (PBT), Glass Filled (1)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (149)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (61)
- Polyester, Glass Filled (4)
- Polyethersulfone (PES), Glass Filled (1)
- Polyphenylene Sulfide (PPS) (184)
- Polyphenylene Sulfide (PPS), Glass Filled (319)
- Pitch - Mating :
- Contact Finish Thickness - Mating :
- Contact Finish - Post :
- Number of Positions or Pins (Grid) :
-
- 1 (1 x 1) (11)
- 10 (1 x 10) (17)
- 10 (2 x 5) (27)
- 100 (4 x 25) (1)
- 11 (1 x 11) (15)
- 12 (1 x 12) (16)
- 12 (2 x 6) (19)
- 13 (1 x 13) (15)
- 132 (14 x 14) (2)
- 14 (1 x 14) (16)
- 14 (2 x 7) (38)
- 15 (1 x 15) (16)
- 16 (1 x 16) (19)
- 16 (2 x 8) (40)
- 17 (1 x 17) (15)
- 18 (1 x 18) (14)
- 18 (2 x 9) (34)
- 19 (1 x 19) (14)
- 2 (1 x 2) (26)
- 20 (1 x 20) (20)
- 20 (2 x 10) (46)
- 21 (1 x 21) (17)
- 22 (1 x 22) (14)
- 22 (2 x 11) (29)
- 23 (1 x 23) (14)
- 24 (1 x 24) (14)
- 24 (2 x 12) (102)
- 25 (1 x 25) (13)
- 26 (1 x 26) (9)
- 26 (2 x 13) (12)
- 27 (1 x 27) (11)
- 28 (1 x 28) (9)
- 28 (2 x 14) (89)
- 29 (1 x 29) (9)
- 3 (1 x 3) (15)
- 30 (1 x 30) (10)
- 30 (2 x 15) (21)
- 31 (1 x 31) (9)
- 32 (1 x 32) (17)
- 32 (2 x 16) (78)
- 33 (1 x 33) (7)
- 34 (1 x 34) (7)
- 34 (2 x 17) (11)
- 35 (1 x 35) (7)
- 36 (1 x 36) (7)
- 36 (2 x 18) (55)
- 37 (1 x 37) (7)
- 38 (1 x 38) (7)
- 38 (2 x 19) (11)
- 39 (1 x 39) (7)
- 391 (18 x 18) (1)
- 4 (1 x 4) (16)
- 4 (2 x 2) (7)
- 40 (1 x 40) (8)
- 40 (2 x 20) (74)
- 41 (1 x 41) (2)
- 42 (1 x 42) (2)
- 42 (2 x 21) (42)
- 43 (1 x 43) (2)
- 44 (1 x 44) (2)
- 44 (2 x 22) (42)
- 45 (1 x 45) (2)
- 46 (1 x 46) (2)
- 47 (1 x 47) (2)
- 48 (1 x 48) (2)
- 48 (2 x 24) (37)
- 49 (1 x 49) (2)
- 5 (1 x 5) (17)
- 50 (1 x 50) (2)
- 50 (2 x 25) (12)
- 51 (1 x 51) (2)
- 52 (1 x 52) (2)
- 53 (1 x 53) (2)
- 54 (1 x 54) (2)
- 55 (1 x 55) (2)
- 56 (1 x 56) (2)
- 56 (2 x 28) (1)
- 57 (1 x 57) (2)
- 58 (1 x 58) (2)
- 58 (2 x 29) (1)
- 59 (1 x 59) (2)
- 6 (1 x 6) (18)
- 6 (2 x 3) (28)
- 60 (1 x 60) (2)
- 60 (2 x 30) (6)
- 61 (1 x 61) (2)
- 62 (1 x 62) (2)
- 63 (1 x 63) (2)
- 64 (1 x 64) (7)
- 64 (2 x 32) (13)
- 7 (1 x 7) (16)
- 8 (1 x 8) (18)
- 8 (2 x 4) (34)
- 8 (Oval) (2)
- 9 (1 x 9) (15)
- Contact Material - Post :
- Applied Filters :
1761 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
3,094
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,828
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
3,835
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,452
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
906
In-stock
|
3M | CONN SOCKET PQFP 100POS TIN-LEAD | OEM | Obsolete | Bulk | 0°C ~ 105°C | Through Hole | Solder | Open Frame | QFP | Polyethersulfone (PES), Glass Filled | - | Tin-Lead | 200.0µin (5.08µm) | Tin-Lead | 100 (4 x 25) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
3,784
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
3,639
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
1,002
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
2,595
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
2,010
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
1,398
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
3,180
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 42POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 42 (2 x 21) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
2,355
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 42POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 42 (2 x 21) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
1,594
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 42POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 42 (2 x 21) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
2,608
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 42POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 42 (2 x 21) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
3,023
In-stock
|
Aries Electronics | CONN SOCKET PGA ZIF GOLD | PRS | Active | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
3,693
In-stock
|
Aries Electronics | CONN SOCKET PGA ZIF GOLD | PLS | Active | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
1,994
In-stock
|
Aries Electronics | CONN SOCKET PGA ZIF GOLD | PLS | Active | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
1,068
In-stock
|
Aries Electronics | CONN SOCKET PGA ZIF GOLD | PRS | Active | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
2,176
In-stock
|
Aries Electronics | CONN SOCKET PGA ZIF GOLD | PLS | Active | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
1,719
In-stock
|
Aries Electronics | CONN SOCKET PGA ZIF GOLD | PRS | Active | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
3,883
In-stock
|
Aries Electronics | CONN SOCKET PGA ZIF GOLD | PRS | Active | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
1,941
In-stock
|
Aries Electronics | CONN SOCKET PGA ZIF GOLD | PLS | Active | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
1,951
In-stock
|
Aries Electronics | CONN SOCKET PGA ZIF GOLD | PRS | Active | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
2,568
In-stock
|
Aries Electronics | CONN SOCKET PGA ZIF GOLD | PRS | Active | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
1,992
In-stock
|
Aries Electronics | CONN SOCKET PGA ZIF GOLD | PLS | Active | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
1,057
In-stock
|
Aries Electronics | CONN SOCKET PGA ZIF GOLD | PLS | Active | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
1,339
In-stock
|
Aries Electronics | CONN SOCKET PGA ZIF GOLD | PRS | Active | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
3,617
In-stock
|
Aries Electronics | CONN SOCKET PGA ZIF GOLD | PLS | Active | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
3,996
In-stock
|
Aries Electronics | CONN SOCKET PGA ZIF GOLD | PRS | Active | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
