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42 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
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VIEW |
1,002
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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VIEW |
2,595
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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VIEW |
2,010
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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VIEW |
1,398
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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VIEW |
2,947
In-stock
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Aries Electronics | CONN IC DIP SOCKET 44POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,960
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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|
VIEW |
3,228
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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VIEW |
853
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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|
VIEW |
3,667
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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VIEW |
784
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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VIEW |
799
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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VIEW |
1,172
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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VIEW |
2,335
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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VIEW |
1,221
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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VIEW |
1,325
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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VIEW |
1,893
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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VIEW |
3,203
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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VIEW |
607
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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|
VIEW |
2,459
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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|
VIEW |
1,014
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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|
VIEW |
3,773
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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|
VIEW |
1,295
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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|
VIEW |
2,888
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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|
VIEW |
3,714
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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VIEW |
871
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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VIEW |
3,102
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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|
VIEW |
1,888
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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|
VIEW |
1,716
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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|
VIEW |
1,372
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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VIEW |
2,825
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 44 (2 x 22) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
