Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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2,390
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Amphenol FCI CONN SOCKET SIP 8POS TIN SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 8 (1 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
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2,028
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Amphenol FCI CONN SOCKET SIP 8POS GOLD SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 8 (1 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
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2,044
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Amphenol FCI CONN SOCKET SIP 8POS TIN SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 150.0µin (3.81µm) Tin 8 (1 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
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2,343
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Amphenol FCI CONN SOCKET SIP 8POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 8 (1 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
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2,495
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Amphenol FCI CONN SOCKET SIP 8POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 8 (1 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
346-43-108-41-013000
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3,219
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 8POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 8 (1 x 8) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
346-93-108-41-013000
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783
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 8POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 8 (1 x 8) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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725
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Aries Electronics CONN SOCKET SIP 8POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 8 (1 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
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1,451
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Aries Electronics CONN SOCKET SIP 8POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 8 (1 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
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2,432
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Aries Electronics CONN SOCKET SIP 8POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 8 (1 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
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3,311
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Aries Electronics CONN SOCKET SIP 8POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 8 (1 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
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2,597
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Aries Electronics CONN SOCKET SIP 8POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 8 (1 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
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2,255
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Aries Electronics CONN SOCKET SIP 8POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 8 (1 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
315-47-108-41-001000
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985
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 8POS GOLD 315 Active Tube -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 8 (1 x 8) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,187
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 8POS GOLD 310 Active Tube -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 8 (1 x 8) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,259
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Aries Electronics CONN SOCKET SIP 8POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 8 (1 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
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2,198
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Aries Electronics CONN SOCKET SIP 8POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 8 (1 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
317-47-108-41-005000
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734
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 8POS GOLD 317 Active Tube -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold Flash Tin 8 (1 x 8) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,628
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Aries Electronics CONN SOCKET SIP 8POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 8 (1 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
317-43-108-41-005000
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2,771
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Mill-Max Manufacturing Corp. CONN SOCKET 8POS .070 STR GOLD 317 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin 8 (1 x 8) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
08-0518-10
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3,791
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Aries Electronics CONN SOCKET SIP 8POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 8 (1 x 8) Beryllium Copper 200.0µin (5.08µm) Brass