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75 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
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VIEW |
993
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 48POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
3,784
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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|
VIEW |
3,639
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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|
VIEW |
1,964
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
711
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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|
VIEW |
658
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
1,329
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 48POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
1,307
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 48POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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|
VIEW |
2,450
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 48POS GOLD | 126 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
VIEW |
2,431
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 48POS GOLD | 127 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
VIEW |
2,610
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 48POS GOLD | 127 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
VIEW |
1,755
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 48POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
VIEW |
734
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 48POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
VIEW |
3,561
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 48POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
VIEW |
2,018
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 48POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
VIEW |
740
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 48POS GOLD | 111 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
VIEW |
1,337
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 48POS GOLD | 124 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
VIEW |
2,058
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 48POS GOLD | 126 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
3,356
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 48POS GOLD | 123 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
VIEW |
1,576
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 48POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
VIEW |
1,249
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
1,735
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
2,918
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 48POS GOLD | 127 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
VIEW |
800
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 48POS GOLD | 127 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
VIEW |
1,051
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
1,130
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
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|
VIEW |
1,619
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
3,229
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
2,109
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
1,844
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS TIN | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
