- Number of Positions or Pins (Grid) :
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103 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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VIEW |
3,784
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 48POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 48 (2 x 24) | Beryllium Copper | |||
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VIEW |
3,639
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 48POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 48 (2 x 24) | Beryllium Copper | |||
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VIEW |
2,010
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 44 (2 x 22) | Beryllium Copper | |||
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VIEW |
1,398
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 44 (2 x 22) | Beryllium Copper | |||
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VIEW |
1,594
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 42 (2 x 21) | Beryllium Copper | |||
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VIEW |
2,608
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 42 (2 x 21) | Beryllium Copper | |||
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VIEW |
711
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 48POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 48 (2 x 24) | Beryllium Copper | |||
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VIEW |
658
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 48POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 48 (2 x 24) | Beryllium Copper | |||
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VIEW |
1,814
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 36POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 36 (2 x 18) | Beryllium Copper | |||
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VIEW |
2,830
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 36POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 36 (2 x 18) | Beryllium Copper | |||
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VIEW |
1,753
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 24POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 24 (2 x 12) | Beryllium Copper | |||
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VIEW |
2,318
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 24POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 24 (2 x 12) | Beryllium Copper | |||
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VIEW |
820
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 42 (2 x 21) | Beryllium Copper | |||
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VIEW |
3,134
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 42 (2 x 21) | Beryllium Copper | |||
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VIEW |
2,740
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 36POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 36 (2 x 18) | Beryllium Copper | |||
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VIEW |
1,849
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 36POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 36 (2 x 18) | Beryllium Copper | |||
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VIEW |
1,172
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 44 (2 x 22) | Beryllium Copper | |||
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VIEW |
2,335
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 44 (2 x 22) | Beryllium Copper | |||
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VIEW |
1,221
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 44 (2 x 22) | Beryllium Copper | |||
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VIEW |
1,325
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 44 (2 x 22) | Beryllium Copper | |||
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VIEW |
1,893
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 44 (2 x 22) | Beryllium Copper | |||
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VIEW |
3,203
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 44 (2 x 22) | Beryllium Copper | |||
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VIEW |
2,030
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 42 (2 x 21) | Beryllium Copper | |||
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VIEW |
3,219
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 42 (2 x 21) | Beryllium Copper | |||
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VIEW |
1,295
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 44 (2 x 22) | Beryllium Copper | |||
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VIEW |
2,888
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 44 (2 x 22) | Beryllium Copper | |||
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VIEW |
1,249
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 36POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 36 (2 x 18) | Beryllium Copper | |||
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VIEW |
1,999
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 36POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 36 (2 x 18) | Beryllium Copper | |||
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VIEW |
1,716
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 44 (2 x 22) | Beryllium Copper | |||
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VIEW |
1,372
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 44POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 44 (2 x 22) | Beryllium Copper | |||
