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Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Package	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Finish Thickness - Post
GLOBAL STOCKS
	AR 10 HZL/01-TT	RFQ VIEW	PDF RFQ	656 In-stock	Assmann WSW Components	CONN IC DIP SOCKET 10POS TIN		-	Active	Tube	-40°C ~ 105°C	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polybutylene Terephthalate (PBT), Glass Filled	0.100" (2.54mm)	Tin	10 (2 x 5)	Beryllium Copper	200.0µin (5.08µm)
	AR 28 HZL/7-TT	RFQ VIEW	PDF RFQ	671 In-stock	Assmann WSW Components	CONN IC DIP SOCKET 28POS TIN		-	Active	Tube	-40°C ~ 105°C	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polybutylene Terephthalate (PBT), Glass Filled	0.100" (2.54mm)	Tin	28 (2 x 14)	Beryllium Copper	200.0µin (5.08µm)
	AR 32 HZL-TT	RFQ VIEW	PDF RFQ	3,355 In-stock	Assmann WSW Components	CONN IC DIP SOCKET 32POS TIN		-	Active	Tube	-40°C ~ 105°C	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polybutylene Terephthalate (PBT), Glass Filled	0.100" (2.54mm)	Tin	32 (2 x 16)	Beryllium Copper	200.0µin (5.08µm)
	AR10-HZW/T-R	RFQ VIEW	PDF RFQ	2,345 In-stock	Assmann WSW Components	CONN IC DIP SOCKET 4POS TIN		-	Active	Bulk	-40°C ~ 105°C	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polybutylene Terephthalate (PBT), Glass Filled	0.100" (2.54mm)	Tin	4 (2 x 2)	Beryllium Copper	200.0µin (5.08µm)
	AR24-HZL/7-TT-R	RFQ VIEW	PDF RFQ	3,589 In-stock	Assmann WSW Components	CONN IC DIP SOCKET 24POS TIN		-	Active	Tube	-40°C ~ 105°C	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polybutylene Terephthalate (PBT), Glass Filled	0.100" (2.54mm)	Tin	24 (2 x 12)	Beryllium Copper	200.0µin (5.08µm)

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