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3 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
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VIEW |
2,714
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 10POS TINLEAD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Vertical | Solder | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Tin-Lead | 10 (2 x 5) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
3,309
In-stock
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Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Vertical | Solder | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,709
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Vertical | Solder | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 10 (2 x 5) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
