Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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AR24-HZL-TT
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2,967
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Assmann WSW Components CONN IC DIP SOCKET 24POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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1,130
In-stock
Amphenol FCI CONN IC DIP SOCKET 24POS TIN - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 100.0µin (2.54µm) 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
3,589
In-stock
Assmann WSW Components CONN IC DIP SOCKET 24POS TIN - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Tin - 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR 24 HZL-TT
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RFQ
1,013
In-stock
Assmann WSW Components CONN IC DIP SOCKET 24POS TIN - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper