Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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2,775
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Aries Electronics CONN SOCKET PGA ZIF GOLD - Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
0804MC
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657
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Texas Instruments CONN TRANSIST TO-3 8POS GOLD - Active Bulk -55°C ~ 150°C Through Hole Solder Closed Frame Transistor, TO-3 Polyester, Glass Filled - Gold 30.0µin (0.76µm) Tin 8 (Oval) Beryllium Copper 200.0µin (5.08µm) Brass