Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
SA649000
RFQ
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RFQ
3,056
In-stock
On Shore Technology Inc. CONN IC DIP SOCKET 64POS GOLD SA Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Thermoplastic, Polyester, Glass Filled 0.100" (2.54mm) Gold Flash 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Brass
AR64-HZL-TT
RFQ
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RFQ
1,557
In-stock
Assmann WSW Components CONN IC DIP SOCKET 64POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR64-HZW/T-R
RFQ
VIEW
RFQ
668
In-stock
Assmann WSW Components CONN IC DIP SOCKET 64POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.9" (22.86mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold - 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR-64-HZL-TT
RFQ
VIEW
RFQ
3,281
In-stock
Assmann WSW Components CONN IC DIP SOCKET 64POS TIN - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper