Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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634
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Amphenol FCI CONN SOCKET SIP 13POS GOLD SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 13 (1 x 13) Beryllium Copper 200.0µin (5.08µm) Brass
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3,922
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Amphenol FCI CONN SOCKET SIP 13POS TIN SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 13 (1 x 13) Beryllium Copper 200.0µin (5.08µm) Brass
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2,794
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Amphenol FCI CONN SOCKET SIP 13POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 13 (1 x 13) Beryllium Copper 200.0µin (5.08µm) Brass
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3,870
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TE Connectivity AMP Connectors CONN SOCKET SIP 13POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 13 (1 x 13) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
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1,017
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Aries Electronics CONN SOCKET SIP 13POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 13 (1 x 13) Beryllium Copper 10.0µin (0.25µm) Brass
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849
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Aries Electronics CONN SOCKET SIP 13POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 13 (1 x 13) Beryllium Copper 10.0µin (0.25µm) Brass
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3,991
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Aries Electronics CONN SOCKET SIP 13POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 13 (1 x 13) Beryllium Copper 10.0µin (0.25µm) Brass
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1,792
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Aries Electronics CONN SOCKET SIP 13POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 13 (1 x 13) Beryllium Copper 10.0µin (0.25µm) Brass
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2,952
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Aries Electronics CONN SOCKET SIP 13POS GOLD 0517 Active Bulk - Through Hole, Right Angle Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled - Gold 30.0µin (0.76µm) Tin 13 (1 x 13) Beryllium Copper 200.0µin (5.08µm) Brass
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656
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Aries Electronics CONN SOCKET SIP 13POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 13 (1 x 13) Beryllium Copper 10.0µin (0.25µm) Brass
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1,246
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Aries Electronics CONN SOCKET SIP 13POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 13 (1 x 13) Beryllium Copper 200.0µin (5.08µm) Brass
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3,669
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Aries Electronics CONN SOCKET SIP 13POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 13 (1 x 13) Beryllium Copper 200.0µin (5.08µm) Brass
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989
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Aries Electronics CONN SOCKET SIP 13POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 13 (1 x 13) Beryllium Copper 200.0µin (5.08µm) Brass
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2,508
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On Shore Technology Inc. CONN SOCKET SIP 13POS GOLD SBU Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 13 (1 x 13) Beryllium Copper 196.9µin (5.00µm) Brass
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2,435
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Harwin Inc. CONN SOCKET SIP 13POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 13 (1 x 13) Beryllium Copper 196.9µin (5.00µm) Brass
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2,898
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Aries Electronics CONN SOCKET SIP 13POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 13 (1 x 13) Beryllium Copper 200.0µin (5.08µm) Brass
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3,138
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Aries Electronics CONN SOCKET SIP 13POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 13 (1 x 13) Beryllium Copper 200.0µin (5.08µm) Brass
714-43-113-31-018000
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3,393
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 13POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 13 (1 x 13) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
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1,786
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Aries Electronics CONN SOCKET SIP 13POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 13 (1 x 13) Beryllium Copper 10.0µin (0.25µm) Brass
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3,172
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Aries Electronics CONN SOCKET SIP 13POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 13 (1 x 13) Beryllium Copper 10.0µin (0.25µm) Brass
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3,893
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TE Connectivity AMP Connectors CONN SOCKET SIP 13POS TIN Diplomate DL Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 13 (1 x 13) Beryllium Copper - Beryllium Copper
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3,865
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Aries Electronics CONN SOCKET SIP 13POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 13 (1 x 13) Beryllium Copper 10.0µin (0.25µm) Brass
346-43-113-41-013000
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685
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 13POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 13 (1 x 13) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,368
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Aries Electronics CONN SOCKET SIP 13POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 13 (1 x 13) Beryllium Copper 200.0µin (5.08µm) Brass
346-93-113-41-013000
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3,234
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 13POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 13 (1 x 13) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,636
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Aries Electronics CONN SOCKET SIP 13POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 13 (1 x 13) Beryllium Copper 200.0µin (5.08µm) Brass
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1,753
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Aries Electronics CONN SOCKET SIP 13POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 13 (1 x 13) Beryllium Copper 200.0µin (5.08µm) Brass
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3,083
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Aries Electronics CONN SOCKET SIP 13POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 13 (1 x 13) Beryllium Copper 200.0µin (5.08µm) Brass
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1,834
In-stock
Aries Electronics CONN SOCKET SIP 13POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 13 (1 x 13) Beryllium Copper 200.0µin (5.08µm) Brass
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3,604
In-stock
Aries Electronics CONN SOCKET SIP 13POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 13 (1 x 13) Beryllium Copper 200.0µin (5.08µm) Brass