Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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668
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD - Active Tube - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) 20 (2 x 10) Beryllium Copper - Brass
2-1571995-0
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1,604
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TE Connectivity AMP Connectors CONN SOCKET SIP 20POS TIN 510 Active Bulk - Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Tin - 20 (2 x 10) Beryllium Copper 20.0µin (0.51µm) Copper
AR20-HZL/07-TT-R
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912
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Assmann WSW Components CONN IC DIP SOCKET 20POS GOLD - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR 20-HZW/TN
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657
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Assmann WSW Components CONN IC DIP SOCKET 20POS GOLD - Active Tube -40°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold - 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR 20 HZL-TT
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RFQ
1,989
In-stock
Assmann WSW Components CONN IC DIP SOCKET 20POS TIN - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper