- Part Status :
- Packaging :
- Operating Temperature :
- Housing Material :
-
- Polyamide (PA), Nylon, Glass Filled (100)
- Polyamide (PA46), Nylon 4/6 (241)
- Polyamide (PA46), Nylon 4/6, Glass Filled (392)
- Polybutylene Terephthalate (PBT) (10)
- Polybutylene Terephthalate (PBT), Glass Filled (3)
- Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled (38)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (318)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (156)
- Polyphenylene Sulfide (PPS), Glass Filled (28)
- Thermoplastic, Polyester (17)
- Pitch - Mating :
- Contact Finish Thickness - Mating :
- Contact Finish - Post :
- Number of Positions or Pins (Grid) :
-
- 1 (1 x 1) (8)
- 10 (1 x 10) (9)
- 10 (2 x 5) (42)
- 11 (1 x 11) (8)
- 12 (1 x 12) (9)
- 12 (2 x 6) (18)
- 13 (1 x 13) (8)
- 132 (14 x 14) (2)
- 14 (1 x 14) (9)
- 14 (2 x 7) (51)
- 15 (1 x 15) (8)
- 16 (1 x 16) (9)
- 16 (2 x 8) (58)
- 17 (1 x 17) (8)
- 18 (1 x 18) (9)
- 18 (2 x 9) (48)
- 19 (1 x 19) (8)
- 2 (1 x 2) (12)
- 20 (1 x 20) (11)
- 20 (2 x 10) (70)
- 21 (1 x 21) (8)
- 22 (1 x 22) (8)
- 22 (2 x 11) (59)
- 23 (1 x 23) (8)
- 24 (1 x 24) (8)
- 24 (2 x 12) (116)
- 25 (1 x 25) (8)
- 26 (1 x 26) (4)
- 26 (2 x 13) (8)
- 27 (1 x 27) (4)
- 28 (1 x 28) (4)
- 28 (2 x 14) (108)
- 29 (1 x 29) (3)
- 3 (1 x 3) (8)
- 30 (1 x 30) (4)
- 30 (2 x 15) (18)
- 31 (1 x 31) (4)
- 32 (1 x 32) (8)
- 32 (2 x 16) (75)
- 33 (1 x 33) (4)
- 34 (1 x 34) (4)
- 34 (2 x 17) (8)
- 35 (1 x 35) (4)
- 36 (1 x 36) (4)
- 36 (2 x 18) (31)
- 37 (1 x 37) (4)
- 38 (1 x 38) (4)
- 38 (2 x 19) (8)
- 39 (1 x 39) (4)
- 4 (1 x 4) (9)
- 4 (2 x 2) (18)
- 40 (1 x 40) (4)
- 40 (2 x 20) (64)
- 42 (2 x 21) (21)
- 44 (2 x 22) (4)
- 48 (2 x 24) (30)
- 5 (1 x 5) (9)
- 50 (2 x 25) (31)
- 52 (2 x 26) (24)
- 56 (2 x 28) (1)
- 6 (1 x 6) (9)
- 6 (2 x 3) (36)
- 60 (2 x 30) (4)
- 64 (1 x 64) (2)
- 64 (2 x 32) (22)
- 68 (11 x 11) (2)
- 68 (2 x 34) (2)
- 7 (1 x 7) (9)
- 8 (1 x 8) (9)
- 8 (2 x 4) (41)
- 9 (1 x 9) (9)
- Contact Finish Thickness - Post :
- Contact Material - Post :
- Applied Filters :
1303 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
1,044
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 24POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
VIEW |
3,236
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 22POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 22 (2 x 11) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
VIEW |
876
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 20POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 20 (2 x 10) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
VIEW |
2,860
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 18POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 18 (2 x 9) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
VIEW |
1,176
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 16POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 16 (2 x 8) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
VIEW |
2,187
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 14POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 14 (2 x 7) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
VIEW |
3,435
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 8POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 8 (2 x 4) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
VIEW |
3,550
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 6POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 6 (2 x 3) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
VIEW |
3,452
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 24POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
VIEW |
3,115
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 40POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | - | Tin | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
2,987
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 28POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | - | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
3,093
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 24POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | - | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
2,577
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 22POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | - | Tin | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
996
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 20POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | - | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
1,711
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 18POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | - | Tin | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
3,658
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 16POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | - | Tin | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
2,399
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 8POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | - | Tin | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
3,651
In-stock
|
Mill-Max Manufacturing Corp. | CONN SOCKET PGA 132POS GOLD | 522 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | PGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 132 (14 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
|
VIEW |
2,189
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 48 (2 x 24) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
741
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 48 (2 x 24) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
668
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 64POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | - | Tin | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
727
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 22POS GOLD | 123 | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame, Decoupling Capacitor | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 22 (2 x 11) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
1,264
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 22POS GOLD | 123 | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame, Decoupling Capacitor | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 22 (2 x 11) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
|
VIEW |
1,512
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 22POS GOLD | 122 | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame, Decoupling Capacitor | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 22 (2 x 11) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
|
VIEW |
1,716
In-stock
|
Mill-Max Manufacturing Corp. | CONN SOCKET PGA 68POS GOLD | 522 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | PGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 68 (11 x 11) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
|
VIEW |
1,456
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 50POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 50 (2 x 25) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
VIEW |
1,908
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 50POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 50 (2 x 25) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
VIEW |
1,357
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,973
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,040
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass |