Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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Aries Electronics CONN SOCKET SIP 39POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 39 (1 x 39) Beryllium Copper 200.0µin (5.08µm) Brass
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1,669
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Aries Electronics CONN SOCKET SIP 39POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 39 (1 x 39) Beryllium Copper 200.0µin (5.08µm) Brass
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3,827
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Aries Electronics CONN SOCKET SIP 39POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 39 (1 x 39) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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699
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Aries Electronics CONN SOCKET SIP 39POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 39 (1 x 39) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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3,980
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Aries Electronics CONN SOCKET SIP 39POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 39 (1 x 39) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
714-43-139-31-018000
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2,719
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 39POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 39 (1 x 39) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
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3,097
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Aries Electronics CONN SOCKET SIP 39POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 39 (1 x 39) Beryllium Copper 200.0µin (5.08µm) Brass
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1,311
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Aries Electronics CONN SOCKET SIP 39POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 39 (1 x 39) Beryllium Copper 10.0µin (0.25µm) Brass
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2,804
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Aries Electronics CONN SOCKET SIP 39POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 39 (1 x 39) Beryllium Copper 10.0µin (0.25µm) Brass
346-93-139-41-013000
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3,332
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 39POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 39 (1 x 39) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,517
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Aries Electronics CONN SOCKET SIP 39POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 39 (1 x 39) Beryllium Copper 200.0µin (5.08µm) Brass
346-43-139-41-013000
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2,611
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 39POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 39 (1 x 39) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,299
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Aries Electronics CONN SOCKET SIP 39POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 39 (1 x 39) Beryllium Copper 10.0µin (0.25µm) Brass
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1,628
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Aries Electronics CONN SOCKET SIP 39POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 39 (1 x 39) Beryllium Copper 200.0µin (5.08µm) Brass
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1,263
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Aries Electronics CONN SOCKET SIP 39POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 39 (1 x 39) Beryllium Copper 10.0µin (0.25µm) Brass
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3,373
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Aries Electronics CONN SOCKET SIP 39POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 39 (1 x 39) Beryllium Copper 200.0µin (5.08µm) Brass