Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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Aries Electronics CONN SOCKET SIP 35POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 35 (1 x 35) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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2,470
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Aries Electronics CONN SOCKET SIP 35POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 35 (1 x 35) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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2,405
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Aries Electronics CONN SOCKET SIP 35POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 35 (1 x 35) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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1,235
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Aries Electronics CONN SOCKET SIP 35POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 35 (1 x 35) Beryllium Copper 200.0µin (5.08µm) Brass
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2,424
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Aries Electronics CONN SOCKET SIP 35POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 35 (1 x 35) Beryllium Copper 200.0µin (5.08µm) Brass
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1,821
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Aries Electronics CONN SOCKET SIP 35POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 35 (1 x 35) Beryllium Copper 10.0µin (0.25µm) Brass
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1,788
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Aries Electronics CONN SOCKET SIP 35POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 35 (1 x 35) Beryllium Copper 10.0µin (0.25µm) Brass
346-93-135-41-013000
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734
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 35POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 35 (1 x 35) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,581
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Aries Electronics CONN SOCKET SIP 35POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 35 (1 x 35) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,517
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Aries Electronics CONN SOCKET SIP 35POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 35 (1 x 35) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,072
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Aries Electronics CONN SOCKET SIP 35POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 35 (1 x 35) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,268
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Aries Electronics CONN SOCKET SIP 35POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 35 (1 x 35) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,269
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Aries Electronics CONN SOCKET SIP 35POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 35 (1 x 35) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
346-43-135-41-013000
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1,437
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 35POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 35 (1 x 35) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,219
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Aries Electronics CONN SOCKET SIP 35POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 35 (1 x 35) Beryllium Copper 200.0µin (5.08µm) Brass
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1,891
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Aries Electronics CONN SOCKET SIP 35POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 35 (1 x 35) Beryllium Copper 10.0µin (0.25µm) Brass
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652
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Aries Electronics CONN SOCKET SIP 35POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 35 (1 x 35) Beryllium Copper 10.0µin (0.25µm) Brass
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3,860
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Aries Electronics CONN SOCKET SIP 35POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 50.0µin (1.27µm) Tin 35 (1 x 35) Phosphor Bronze 50.0µin (1.27µm) Phosphor Bronze
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3,675
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Aries Electronics CONN SOCKET SIP 35POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 35 (1 x 35) Beryllium Copper 200.0µin (5.08µm) Brass
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966
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Aries Electronics CONN SOCKET SIP 35POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 35 (1 x 35) Beryllium Copper 200.0µin (5.08µm) Brass
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3,665
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Aries Electronics CONN SOCKET SIP 35POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 35 (1 x 35) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
714-43-135-31-018000
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2,754
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 35POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 35 (1 x 35) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
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1,496
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Aries Electronics CONN SOCKET SIP 35POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 35 (1 x 35) Beryllium Copper 200.0µin (5.08µm) Brass