Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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3,769
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Amphenol FCI CONN SOCKET SIP 24POS TIN SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 24 (1 x 24) Beryllium Copper 200.0µin (5.08µm) Brass
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611
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Amphenol FCI CONN SOCKET SIP 24POS GOLD SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 24 (1 x 24) Beryllium Copper 200.0µin (5.08µm) Brass
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3,987
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Aries Electronics CONN SOCKET SIP 24POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 50.0µin (1.27µm) Tin 24 (1 x 24) Phosphor Bronze 50.0µin (1.27µm) Phosphor Bronze
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742
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Aries Electronics CONN SOCKET SIP 24POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (1 x 24) Beryllium Copper 200.0µin (5.08µm) Brass
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2,869
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Aries Electronics CONN SOCKET SIP 24POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (1 x 24) Beryllium Copper 200.0µin (5.08µm) Brass
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1,900
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Aries Electronics CONN SOCKET SIP 24POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (1 x 24) Beryllium Copper 200.0µin (5.08µm) Brass
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2,994
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Aries Electronics CONN SOCKET SIP 24POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 24 (1 x 24) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,834
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Aries Electronics CONN SOCKET SIP 24POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 24 (1 x 24) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,283
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Aries Electronics CONN SOCKET SIP 24POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 24 (1 x 24) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
346-43-124-41-013000
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3,260
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 24POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 24 (1 x 24) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,077
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Aries Electronics CONN SOCKET SIP 24POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (1 x 24) Beryllium Copper 200.0µin (5.08µm) Brass
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3,687
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Aries Electronics CONN SOCKET SIP 24POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (1 x 24) Beryllium Copper 200.0µin (5.08µm) Brass
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2,910
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Harwin Inc. CONN SOCKET SIP 24POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 24 (1 x 24) Beryllium Copper 196.9µin (5.00µm) Brass
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3,145
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Aries Electronics CONN SOCKET SIP 24POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 24 (1 x 24) Beryllium Copper 200.0µin (5.08µm) Brass
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3,366
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Aries Electronics CONN SOCKET SIP 24POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 24 (1 x 24) Beryllium Copper 200.0µin (5.08µm) Brass
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2,489
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Aries Electronics CONN SOCKET SIP 24POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 24 (1 x 24) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,095
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Aries Electronics CONN SOCKET SIP 24POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 24 (1 x 24) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,199
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Aries Electronics CONN SOCKET SIP 24POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (1 x 24) Beryllium Copper 200.0µin (5.08µm) Brass
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639
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Aries Electronics CONN SOCKET SIP 24POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (1 x 24) Beryllium Copper 200.0µin (5.08µm) Brass
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2,729
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Aries Electronics CONN SOCKET SIP 24POS GOLD 0517 Active Bulk - Through Hole, Right Angle Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled - Gold 30.0µin (0.76µm) Tin 24 (1 x 24) Beryllium Copper 200.0µin (5.08µm) Brass
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2,149
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Aries Electronics CONN SOCKET SIP 24POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (1 x 24) Beryllium Copper 200.0µin (5.08µm) Brass
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2,132
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Aries Electronics CONN SOCKET SIP 24POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (1 x 24) Beryllium Copper 200.0µin (5.08µm) Brass