Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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3,766
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Amphenol FCI CONN SOCKET SIP 22POS TIN SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 22 (1 x 22) Beryllium Copper 200.0µin (5.08µm) Brass
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2,412
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Amphenol FCI CONN SOCKET SIP 22POS GOLD SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 22 (1 x 22) Beryllium Copper 200.0µin (5.08µm) Brass
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3,784
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Aries Electronics CONN SOCKET SIP 22POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 22 (1 x 22) Beryllium Copper 10.0µin (0.25µm) Brass
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746
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Aries Electronics CONN SOCKET SIP 22POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 22 (1 x 22) Beryllium Copper 10.0µin (0.25µm) Brass
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3,852
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Aries Electronics CONN SOCKET SIP 22POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 22 (1 x 22) Beryllium Copper 10.0µin (0.25µm) Brass
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2,664
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Aries Electronics CONN SOCKET SIP 22POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 22 (1 x 22) Beryllium Copper 200.0µin (5.08µm) Brass
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1,592
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Aries Electronics CONN SOCKET SIP 22POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 22 (1 x 22) Beryllium Copper 200.0µin (5.08µm) Brass
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1,523
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Aries Electronics CONN SOCKET SIP 22POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 22 (1 x 22) Beryllium Copper 200.0µin (5.08µm) Brass
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2,587
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Aries Electronics CONN SOCKET SIP 22POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 22 (1 x 22) Beryllium Copper 200.0µin (5.08µm) Brass
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3,182
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Aries Electronics CONN SOCKET SIP 22POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 22 (1 x 22) Beryllium Copper 200.0µin (5.08µm) Brass
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2,699
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Aries Electronics CONN SOCKET SIP 22POS GOLD 0517 Active Bulk - Through Hole, Right Angle Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled - Gold 30.0µin (0.76µm) Tin 22 (1 x 22) Beryllium Copper 200.0µin (5.08µm) Brass
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1,961
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Aries Electronics CONN SOCKET SIP 22POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 22 (1 x 22) Beryllium Copper 10.0µin (0.25µm) Brass
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3,930
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Aries Electronics CONN SOCKET SIP 22POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 22 (1 x 22) Beryllium Copper 10.0µin (0.25µm) Brass
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3,051
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Aries Electronics CONN SOCKET SIP 22POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 22 (1 x 22) Beryllium Copper 200.0µin (5.08µm) Brass
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2,181
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Aries Electronics CONN SOCKET SIP 22POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 22 (1 x 22) Beryllium Copper 10.0µin (0.25µm) Brass
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3,290
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Aries Electronics CONN SOCKET SIP 22POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 22 (1 x 22) Beryllium Copper 200.0µin (5.08µm) Brass
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2,500
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Aries Electronics CONN SOCKET SIP 22POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 22 (1 x 22) Beryllium Copper 200.0µin (5.08µm) Brass
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2,218
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Aries Electronics CONN SOCKET SIP 22POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 22 (1 x 22) Beryllium Copper 200.0µin (5.08µm) Brass