Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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954
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Amphenol FCI CONN SOCKET SIP 17POS GOLD SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 17 (1 x 17) Beryllium Copper 200.0µin (5.08µm) Brass
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1,468
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Amphenol FCI CONN SOCKET SIP 17POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 17 (1 x 17) Beryllium Copper 200.0µin (5.08µm) Brass
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2,852
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Aries Electronics CONN SOCKET SIP 17POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 17 (1 x 17) Beryllium Copper 10.0µin (0.25µm) Brass
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3,826
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Aries Electronics CONN SOCKET SIP 17POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 17 (1 x 17) Beryllium Copper 10.0µin (0.25µm) Brass
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3,871
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Aries Electronics CONN SOCKET SIP 17POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 17 (1 x 17) Beryllium Copper 200.0µin (5.08µm) Brass
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2,441
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Aries Electronics CONN SOCKET SIP 17POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 17 (1 x 17) Beryllium Copper 200.0µin (5.08µm) Brass
714-43-117-31-018000
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1,115
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 17POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 17 (1 x 17) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
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3,222
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Aries Electronics CONN SOCKET SIP 17POS GOLD 0517 Active Bulk - Through Hole, Right Angle Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled - Gold 30.0µin (0.76µm) Tin 17 (1 x 17) Beryllium Copper 200.0µin (5.08µm) Brass
346-43-117-41-013000
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3,273
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 17POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 17 (1 x 17) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
346-93-117-41-013000
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3,702
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 17POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 17 (1 x 17) Beryllium Copper 200.0µin (5.08µm) Brass Alloy