Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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2,339
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Amphenol FCI CONN SOCKET SIP 30POS TIN SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 30 (1 x 30) Beryllium Copper 200.0µin (5.08µm) Brass
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688
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Amphenol FCI CONN SOCKET SIP 30POS GOLD SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 30 (1 x 30) Beryllium Copper 200.0µin (5.08µm) Brass
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3,885
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Amphenol FCI CONN SOCKET SIP 30POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 30 (1 x 30) Beryllium Copper 200.0µin (5.08µm) Brass
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3,771
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TE Connectivity AMP Connectors CONN SOCKET SIP 30POS TIN - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Tin 196.9µin (5.00µm) Tin 30 (1 x 30) Beryllium Copper 196.9µin (5.00µm) Brass
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2,666
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Aries Electronics CONN SOCKET SIP 30POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 30 (1 x 30) Beryllium Copper 200.0µin (5.08µm) Brass
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1,995
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Aries Electronics CONN SOCKET SIP 30POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 30 (1 x 30) Beryllium Copper 200.0µin (5.08µm) Brass
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3,356
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Aries Electronics CONN SOCKET SIP 30POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 30 (1 x 30) Beryllium Copper 200.0µin (5.08µm) Brass
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3,323
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Aries Electronics CONN SOCKET SIP 30POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 30 (1 x 30) Beryllium Copper 200.0µin (5.08µm) Brass
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1,185
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Aries Electronics CONN SOCKET SIP 30POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 30 (1 x 30) Beryllium Copper 200.0µin (5.08µm) Brass
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3,388
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Aries Electronics CONN SOCKET SIP 30POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 30 (1 x 30) Beryllium Copper 200.0µin (5.08µm) Brass
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2,588
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Harwin Inc. CONN SOCKET SIP 30POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 30 (1 x 30) Beryllium Copper 196.9µin (5.00µm) Brass