Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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2,945
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Amphenol FCI CONN SOCKET SIP 27POS GOLD SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 27 (1 x 27) Beryllium Copper 200.0µin (5.08µm) Brass
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1,488
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Amphenol FCI CONN SOCKET SIP 27POS TIN SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 27 (1 x 27) Beryllium Copper 200.0µin (5.08µm) Brass
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3,458
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Amphenol FCI CONN SOCKET SIP 27POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 27 (1 x 27) Beryllium Copper 200.0µin (5.08µm) Brass
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3,699
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Amphenol FCI CONN SOCKET SIP 27POS TIN SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 150.0µin (3.81µm) Tin 27 (1 x 27) Beryllium Copper 200.0µin (5.08µm) Brass
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1,753
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Aries Electronics CONN SOCKET SIP 27POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 27 (1 x 27) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,011
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Aries Electronics CONN SOCKET SIP 27POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 27 (1 x 27) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,150
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Aries Electronics CONN SOCKET SIP 27POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 27 (1 x 27) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,110
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Aries Electronics CONN SOCKET SIP 27POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 27 (1 x 27) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,819
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Aries Electronics CONN SOCKET SIP 27POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 27 (1 x 27) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,598
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Aries Electronics CONN SOCKET SIP 27POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 27 (1 x 27) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,827
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Aries Electronics CONN SOCKET SIP 27POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 27 (1 x 27) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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740
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Aries Electronics CONN SOCKET SIP 27POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 27 (1 x 27) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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766
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Aries Electronics CONN SOCKET SIP 27POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 27 (1 x 27) Beryllium Copper 200.0µin (5.08µm) Brass
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3,172
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Aries Electronics CONN SOCKET SIP 27POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 27 (1 x 27) Beryllium Copper 200.0µin (5.08µm) Brass
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1,988
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Aries Electronics CONN SOCKET SIP 27POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 27 (1 x 27) Beryllium Copper 200.0µin (5.08µm) Brass
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3,592
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Aries Electronics CONN SOCKET SIP 27POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 27 (1 x 27) Beryllium Copper 200.0µin (5.08µm) Brass
346-43-127-41-013000
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1,255
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 27POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 27 (1 x 27) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
346-93-127-41-013000
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1,485
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 27POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 27 (1 x 27) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,613
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Aries Electronics CONN SOCKET SIP 27POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 27 (1 x 27) Beryllium Copper 200.0µin (5.08µm) Brass
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3,420
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Aries Electronics CONN SOCKET SIP 27POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 27 (1 x 27) Beryllium Copper 200.0µin (5.08µm) Brass