Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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853
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Amphenol FCI CONN SOCKET SIP 6POS GOLD SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 6 (1 x 6) Beryllium Copper 200.0µin (5.08µm) Brass
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2,182
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Amphenol FCI CONN SOCKET SIP 6POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 6 (1 x 6) Beryllium Copper 200.0µin (5.08µm) Brass
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2,412
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Aries Electronics CONN SOCKET SIP 6POS GOLD 0517 Active Bulk - Through Hole, Right Angle Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled - Gold 30.0µin (0.76µm) Tin 6 (1 x 6) Beryllium Copper 200.0µin (5.08µm) Brass
714-43-106-31-018000
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 6POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 6 (1 x 6) Beryllium Copper 30.0µin (0.76µm) Brass Alloy