Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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1,164
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Harwin Inc. CONN SOCKET SIP 4POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 4 (1 x 4) Beryllium Copper - Brass
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3,013
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Amphenol FCI CONN SOCKET SIP 4POS GOLD SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 4 (1 x 4) Beryllium Copper 200.0µin (5.08µm) Brass
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2,952
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Amphenol FCI CONN SOCKET SIP 4POS TIN SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 4 (1 x 4) Beryllium Copper 200.0µin (5.08µm) Brass
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2,188
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Amphenol FCI CONN SOCKET SIP 4POS TIN SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 150.0µin (3.81µm) Tin 4 (1 x 4) Beryllium Copper 200.0µin (5.08µm) Brass
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1,602
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Amphenol FCI CONN SOCKET SIP 4POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 4 (1 x 4) Beryllium Copper 200.0µin (5.08µm) Brass
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3,946
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TE Connectivity AMP Connectors CONN SOCKET SIP 4POS GOLD - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 29.5µin (0.75µm) Gold 4 (1 x 4) Beryllium Copper 29.5µin (0.75µm) Brass
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2,104
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TE Connectivity AMP Connectors CONN SOCKET SIP 4POS TIN - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Tin 196.9µin (5.00µm) Tin 4 (1 x 4) Beryllium Copper 196.9µin (5.00µm) Brass
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2,493
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Aries Electronics CONN SOCKET SIP 4POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 4 (1 x 4) Beryllium Copper 10.0µin (0.25µm) Brass
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3,940
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Aries Electronics CONN SOCKET SIP 4POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 4 (1 x 4) Beryllium Copper 10.0µin (0.25µm) Brass
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2,063
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Aries Electronics CONN SOCKET SIP 4POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 4 (1 x 4) Beryllium Copper 200.0µin (5.08µm) Brass
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2,528
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Aries Electronics CONN SOCKET SIP 4POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 4 (1 x 4) Beryllium Copper 200.0µin (5.08µm) Brass
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861
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Aries Electronics CONN SOCKET SIP 4POS GOLD 0517 Active Bulk - Through Hole, Right Angle Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled - Gold 30.0µin (0.76µm) Tin 4 (1 x 4) Beryllium Copper 200.0µin (5.08µm) Brass
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1,419
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Aries Electronics CONN SOCKET SIP 4POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 4 (1 x 4) Beryllium Copper 10.0µin (0.25µm) Brass
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1,055
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Aries Electronics CONN SOCKET SIP 4POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 4 (1 x 4) Beryllium Copper 200.0µin (5.08µm) Brass
04-0513-10T
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1,340
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Aries Electronics CONN SOCKET SIP 4POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 4 (1 x 4) Beryllium Copper 200.0µin (5.08µm) Brass
04-0513-10
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2,690
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Aries Electronics CONN SOCKET SIP 4POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 4 (1 x 4) Beryllium Copper 200.0µin (5.08µm) Brass
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3,225
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Aries Electronics CONN SOCKET SIP 4POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 4 (1 x 4) Beryllium Copper 200.0µin (5.08µm) Brass
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2,570
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Aries Electronics CONN SOCKET SIP 4POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 4 (1 x 4) Beryllium Copper 200.0µin (5.08µm) Brass
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1,741
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Harwin Inc. CONN SOCKET SIP 4POS GOLD D01-995 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 4 (1 x 4) Beryllium Copper 196.9µin (5.00µm) Brass
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3,289
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Aries Electronics CONN SOCKET SIP 4POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 4 (1 x 4) Beryllium Copper 200.0µin (5.08µm) Brass
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760
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Aries Electronics CONN SOCKET SIP 4POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 4 (1 x 4) Beryllium Copper 10.0µin (0.25µm) Brass
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3,761
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Aries Electronics CONN SOCKET SIP 4POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 4 (1 x 4) Beryllium Copper 10.0µin (0.25µm) Brass
714-43-104-31-018000
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3,320
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 4POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 4 (1 x 4) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
04-0513-10H
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2,884
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Aries Electronics CONN SOCKET SIP 4POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 4 (1 x 4) Beryllium Copper 200.0µin (5.08µm) Brass
346-93-104-41-013000
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1,086
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 4POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 4 (1 x 4) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,135
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Aries Electronics CONN SOCKET SIP 4POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 4 (1 x 4) Beryllium Copper 200.0µin (5.08µm) Brass
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3,996
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Aries Electronics CONN SOCKET SIP 4POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 4 (1 x 4) Beryllium Copper 200.0µin (5.08µm) Brass
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1,523
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Aries Electronics CONN SOCKET SIP 4POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 4 (1 x 4) Beryllium Copper 10.0µin (0.25µm) Brass
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815
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Aries Electronics CONN SOCKET SIP 4POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 4 (1 x 4) Beryllium Copper 10.0µin (0.25µm) Brass
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3,380
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Aries Electronics CONN SOCKET SIP 4POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 4 (1 x 4) Beryllium Copper 10.0µin (0.25µm) Brass