Packaging :
Contact Material - Mating :
Contact Finish Thickness - Post :
Contact Material - Post :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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3,043
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TE Connectivity AMP Connectors CONN SOCKET SIP 10POS GOLD - Obsolete - - Through Hole Solder Closed Frame SIP Polyester 0.100" (2.54mm) Gold Flash Tin 10 (1 x 10) Beryllium Copper Flash Beryllium Copper
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3,521
In-stock
Harwin Inc. CONN SOCKET SIP 10POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 10 (1 x 10) Beryllium Copper - Brass
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2,212
In-stock
Amphenol FCI CONN SOCKET SIP 10POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
806
In-stock
Amphenol FCI CONN SOCKET SIP 10POS GOLD SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
1,782
In-stock
Amphenol FCI CONN SOCKET SIP 10POS TIN SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
3,087
In-stock
Amphenol FCI CONN SOCKET SIP 10POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
2,019
In-stock
Amphenol FCI CONN SOCKET SIP 10POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
643642-8
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3,308
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 10POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 10 (1 x 10) Phosphor Bronze - Phosphor Bronze
643642-1
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RFQ
1,536
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 10POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 10 (1 x 10) Beryllium Copper - Beryllium Copper
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RFQ
1,877
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 10POS TIN - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Tin 196.9µin (5.00µm) Tin 10 (1 x 10) Beryllium Copper 196.9µin (5.00µm) Brass
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RFQ
1,077
In-stock
Aries Electronics CONN SOCKET SIP 10POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 10 (1 x 10) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,467
In-stock
Aries Electronics CONN SOCKET SIP 10POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 10 (1 x 10) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
3,844
In-stock
Aries Electronics CONN SOCKET SIP 10POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 10 (1 x 10) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
1,088
In-stock
Aries Electronics CONN SOCKET SIP 10POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 10 (1 x 10) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
VIEW
RFQ
1,807
In-stock
Aries Electronics CONN SOCKET SIP 10POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 10 (1 x 10) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
2,784
In-stock
Aries Electronics CONN SOCKET SIP 10POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 10 (1 x 10) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
3,451
In-stock
Aries Electronics CONN SOCKET SIP 10POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 10 (1 x 10) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
3,139
In-stock
Aries Electronics CONN SOCKET SIP 10POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 10 (1 x 10) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
3,014
In-stock
Aries Electronics CONN SOCKET SIP 10POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 10 (1 x 10) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
3,602
In-stock
Aries Electronics CONN SOCKET SIP 10POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 10 (1 x 10) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
2,957
In-stock
Aries Electronics CONN SOCKET SIP 10POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 10 (1 x 10) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
764
In-stock
Aries Electronics CONN SOCKET SIP 10POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 10 (1 x 10) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
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RFQ
2,764
In-stock
Aries Electronics CONN SOCKET SIP 10POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 10 (1 x 10) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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662
In-stock
Aries Electronics CONN SOCKET SIP 10POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 10 (1 x 10) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
2,686
In-stock
Aries Electronics CONN SOCKET SIP 10POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
3,225
In-stock
Aries Electronics CONN SOCKET SIP 10POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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2,201
In-stock
Aries Electronics CONN SOCKET SIP 10POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
3,859
In-stock
Harwin Inc. CONN SOCKET SIP 10POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 10 (1 x 10) Beryllium Copper 196.9µin (5.00µm) Brass
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3,140
In-stock
Aries Electronics CONN SOCKET SIP 10POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 50.0µin (1.27µm) Tin 10 (1 x 10) Phosphor Bronze 50.0µin (1.27µm) Phosphor Bronze
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3,818
In-stock
Aries Electronics CONN SOCKET SIP 10POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 10 (1 x 10) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze