Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
AR40-HZL-TT
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RFQ
3,203
In-stock
Assmann WSW Components CONN IC DIP SOCKET 40POS TIN - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin - 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR40-HZW/T
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RFQ
3,115
In-stock
Assmann WSW Components CONN IC DIP SOCKET 40POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold - 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
Default Photo
RFQ
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RFQ
1,242
In-stock
Amphenol FCI CONN IC DIP SOCKET 40POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
RFQ
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RFQ
2,500
In-stock
Amphenol FCI CONN IC DIP SOCKET 40POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
AR40-HZL/07-TT
RFQ
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RFQ
1,835
In-stock
Assmann WSW Components CONN IC DIP SOCKET 40POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
AR40-HZL/01-TT
RFQ
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RFQ
2,595
In-stock
Assmann WSW Components CONN IC DIP SOCKET 40POS GOLD - Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
2-641268-1
RFQ
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RFQ
1,821
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 40 (2 x 20) Beryllium Copper - Beryllium Copper
2-641606-2
RFQ
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RFQ
2,902
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
2-641616-2
RFQ
VIEW
RFQ
3,397
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
1-1825108-3
RFQ
VIEW
RFQ
3,445
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
690
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD 800 Obsolete Tube - Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold - 40 (2 x 20) Beryllium Copper - Brass
2-641616-1
RFQ
VIEW
RFQ
3,968
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic 0.100" (2.54mm) Tin - 40 (2 x 20) Beryllium Copper - Beryllium Copper