Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
GLOBAL STOCKS
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2,839
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD 700 Obsolete - -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.6" (15.24mm) Row Spacing Aluminum Alloy 0.100" (2.54mm) Gold 20.0µin (0.51µm) 40 (2 x 20) Beryllium Copper
2-641606-2
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RFQ
2,902
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper
2-641616-2
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RFQ
3,397
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper
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RFQ
2,864
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Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 40POS GOLD XR2 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Carrier DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 40 (2 x 20) Beryllium Copper
1-1825108-3
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RFQ
3,445
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper