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Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Package	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Contact Material - Mating
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	40-6553-16	RFQ VIEW	PDF RFQ	3,138 In-stock	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS		55	Active	Bulk	-55°C ~ 250°C	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyetheretherketone (PEEK), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	40 (2 x 20)	Beryllium Nickel
	40-6571-16	RFQ VIEW	PDF RFQ	3,534 In-stock	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS		57	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	40 (2 x 20)	Beryllium Nickel
	40-6570-16	RFQ VIEW	PDF RFQ	3,188 In-stock	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS		57	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	40 (2 x 20)	Beryllium Nickel
	40-3573-16	RFQ VIEW	PDF RFQ	2,121 In-stock	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS		57	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	40 (2 x 20)	Beryllium Nickel
	40-3572-16	RFQ VIEW	PDF RFQ	922 In-stock	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS		57	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	40 (2 x 20)	Beryllium Nickel
	40-3571-16	RFQ VIEW	PDF RFQ	3,320 In-stock	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS		57	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	40 (2 x 20)	Beryllium Nickel
	40-3570-16	RFQ VIEW	PDF RFQ	2,535 In-stock	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS		57	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	40 (2 x 20)	Beryllium Nickel
	40-3554-18	RFQ VIEW	PDF RFQ	2,170 In-stock	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS		55	Active	Bulk	-55°C ~ 250°C	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	Polyetheretherketone (PEEK), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	40 (2 x 20)	Beryllium Nickel
	40-6554-18	RFQ VIEW	PDF RFQ	1,743 In-stock	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS		55	Active	Bulk	-55°C ~ 250°C	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyetheretherketone (PEEK), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	40 (2 x 20)	Beryllium Nickel
	40-6552-18	RFQ VIEW	PDF RFQ	2,406 In-stock	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS		55	Active	Bulk	-55°C ~ 250°C	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyetheretherketone (PEEK), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	40 (2 x 20)	Beryllium Nickel
	40-6551-18	RFQ VIEW	PDF RFQ	641 In-stock	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS		55	Active	Bulk	-55°C ~ 250°C	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyetheretherketone (PEEK), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	40 (2 x 20)	Beryllium Nickel
	40-3553-18	RFQ VIEW	PDF RFQ	1,997 In-stock	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS		55	Active	Bulk	-55°C ~ 250°C	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	Polyetheretherketone (PEEK), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	40 (2 x 20)	Beryllium Nickel
	40-3552-18	RFQ VIEW	PDF RFQ	1,279 In-stock	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS		55	Active	Bulk	-55°C ~ 250°C	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	Polyetheretherketone (PEEK), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	40 (2 x 20)	Beryllium Nickel
	40-3551-18	RFQ VIEW	PDF RFQ	944 In-stock	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS		55	Active	Bulk	-55°C ~ 250°C	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	Polyetheretherketone (PEEK), Glass Filled	0.100" (2.54mm)	Nickel Boron	50.0µin (1.27µm)	40 (2 x 20)	Beryllium Nickel

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