Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
A40-LCG
RFQ
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RFQ
1,037
In-stock
Assmann WSW Components CONN IC DIP SOCKET 40POS GOLD - Obsolete - Through Hole - Open Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold - Gold 40 (2 x 20) - - -
40-516-10
RFQ
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RFQ
3,434
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 40POS TIN 516 Obsolete Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 10.0µin (0.25µm) Tin 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
1,242
In-stock
Amphenol FCI CONN IC DIP SOCKET 40POS GOLD - Obsolete Tube Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
2,500
In-stock
Amphenol FCI CONN IC DIP SOCKET 40POS GOLD - Obsolete Tube Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
3,463
In-stock
3M CONN IC DIP SOCKET 40POS GOLD 400 Obsolete - Through Hole - Open Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold 40 (2 x 20) - 8.00µin (0.203µm) -
Default Photo
RFQ
VIEW
RFQ
1,065
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS 500 Obsolete - Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) - - - 40 (2 x 20) - - -
Default Photo
RFQ
VIEW
RFQ
1,438
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS 500 Obsolete - Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) - - - 40 (2 x 20) - - -
Default Photo
RFQ
VIEW
RFQ
690
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD 800 Obsolete Tube Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold - - 40 (2 x 20) Beryllium Copper - Brass
Default Photo
RFQ
VIEW
RFQ
2,297
In-stock
3M CONN IC DIP SOCKET 40POS GOLD 400 Obsolete - Through Hole - Open Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold 40 (2 x 20) - 8.00µin (0.203µm) -