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24 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||
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VIEW |
3,974
In-stock
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Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | Edge-Grip™, C91 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 22 (2 x 11) | Phosphor Bronze | |||
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VIEW |
2,250
In-stock
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Aries Electronics | CONN IC DIP SOCKET 22POS TIN | Edge-Grip™, C81 | Obsolete | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 22 (2 x 11) | Phosphor Bronze | |||
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VIEW |
2,145
In-stock
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Assmann WSW Components | CONN IC DIP SOCKET 22POS TIN | - | Obsolete | Tube | -55°C ~ 85°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT) | 0.100" (2.54mm) | Tin | - | 22 (2 x 11) | Phosphor Bronze | |||
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VIEW |
2,686
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 22POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | 22 (2 x 11) | Phosphor Bronze | |||
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VIEW |
1,227
In-stock
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Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 22 (2 x 11) | Phosphor Bronze | |||
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VIEW |
3,959
In-stock
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Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 22 (2 x 11) | Phosphor Bronze | |||
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VIEW |
2,470
In-stock
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Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 22 (2 x 11) | Phosphor Bronze | |||
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VIEW |
1,027
In-stock
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Aries Electronics | CONN IC DIP SOCKET 22POS TIN | 6621 | Active | Bulk | -55°C ~ 105°C | Through Hole, Bottom Entry; Through Board | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 22 (2 x 11) | Phosphor Bronze | |||
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VIEW |
2,105
In-stock
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Aries Electronics | CONN IC DIP SOCKET 22POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 22 (2 x 11) | Phosphor Bronze | |||
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VIEW |
1,568
In-stock
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Aries Electronics | CONN IC DIP SOCKET 22POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 22 (2 x 11) | Phosphor Bronze | |||
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VIEW |
1,870
In-stock
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Aries Electronics | CONN IC DIP SOCKET 22POS TIN | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 22 (2 x 11) | Phosphor Bronze | |||
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VIEW |
1,667
In-stock
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Aries Electronics | CONN IC DIP SOCKET 22POS TIN | 501 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 22 (2 x 11) | Phosphor Bronze | |||
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VIEW |
765
In-stock
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Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | 511 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 22 (2 x 11) | Phosphor Bronze | |||
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VIEW |
3,309
In-stock
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Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 22 (2 x 11) | Phosphor Bronze | |||
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VIEW |
722
In-stock
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Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 22 (2 x 11) | Phosphor Bronze | |||
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VIEW |
1,282
In-stock
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CNC Tech | CONN IC DIP SOCKET 22POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | 22 (2 x 11) | Phosphor Bronze | |||
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VIEW |
2,934
In-stock
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Aries Electronics | CONN IC DIP SOCKET 22POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 22 (2 x 11) | Phosphor Bronze | |||
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VIEW |
2,020
In-stock
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Assmann WSW Components | CONN IC DIP SOCKET 22POS TIN | - | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | - | 22 (2 x 11) | Phosphor Bronze | |||
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|
VIEW |
1,696
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | 511 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 22 (2 x 11) | Phosphor Bronze | |||
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|
VIEW |
2,483
In-stock
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Aries Electronics | CONN IC DIP SOCKET 22POS TIN | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 22 (2 x 11) | Phosphor Bronze | |||
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|
VIEW |
2,665
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 22POS TIN | 501 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 22 (2 x 11) | Phosphor Bronze | |||
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VIEW |
1,288
In-stock
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CNC Tech | CONN IC DIP SOCKET 22POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole, Kinked Pin | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | 22 (2 x 11) | Phosphor Bronze | |||
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|
VIEW |
621
In-stock
|
CNC Tech | CONN IC DIP SOCKET 22POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | 22 (2 x 11) | Phosphor Bronze | |||
|
VIEW |
2,207
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 22POS TIN | - | Active | Tube | -55°C ~ 85°C | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polybutylene Terephthalate (PBT) | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | 22 (2 x 11) | Phosphor Bronze | |||
