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Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Package	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Finish Thickness - Post	Contact Material - Post
GLOBAL STOCKS
	22-3503-31	RFQ VIEW	PDF RFQ	2,442 In-stock	Aries Electronics	CONN IC DIP SOCKET 22POS GOLD		503	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	22 (2 x 11)	Beryllium Copper	10.0µin (0.25µm)	Phosphor Bronze
	22-3503-21	RFQ VIEW	PDF RFQ	3,271 In-stock	Aries Electronics	CONN IC DIP SOCKET 22POS GOLD		503	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	22 (2 x 11)	Beryllium Copper	10.0µin (0.25µm)	Phosphor Bronze
	22-3513-10T	RFQ VIEW	PDF RFQ	2,907 In-stock	Aries Electronics	CONN IC DIP SOCKET 22POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	22 (2 x 11)	Beryllium Copper	200.0µin (5.08µm)	Brass
	22-3513-11H	RFQ VIEW	PDF RFQ	3,795 In-stock	Aries Electronics	CONN IC DIP SOCKET 22POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	22 (2 x 11)	Beryllium Copper	10.0µin (0.25µm)	Brass
	22-3513-11	RFQ VIEW	PDF RFQ	1,998 In-stock	Aries Electronics	CONN IC DIP SOCKET 22POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	22 (2 x 11)	Beryllium Copper	10.0µin (0.25µm)	Brass
	22-3513-10	RFQ VIEW	PDF RFQ	2,942 In-stock	Aries Electronics	CONN IC DIP SOCKET 22POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	22 (2 x 11)	Beryllium Copper	200.0µin (5.08µm)	Brass
	22-3503-30	RFQ VIEW	PDF RFQ	912 In-stock	Aries Electronics	CONN IC DIP SOCKET 22POS GOLD		503	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	22 (2 x 11)	Beryllium Copper	200.0µin (5.08µm)	Phosphor Bronze
	22-3503-20	RFQ VIEW	PDF RFQ	1,537 In-stock	Aries Electronics	CONN IC DIP SOCKET 22POS GOLD		503	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	22 (2 x 11)	Beryllium Copper	200.0µin (5.08µm)	Phosphor Bronze
	22-3513-10H	RFQ VIEW	PDF RFQ	3,324 In-stock	Aries Electronics	CONN IC DIP SOCKET 22POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	22 (2 x 11)	Beryllium Copper	200.0µin (5.08µm)	Brass

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