Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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2,031
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,111
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,963
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Aries Electronics CONN IC DIP SOCKET 22POS GOLD Correct-A-Chip® 1109800 Active Bulk - Through Hole Solder Programmable DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
110-93-422-41-605000
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1,982
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-322-41-001000
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728
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,597
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,695
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,373
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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717
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,831
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 111 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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648
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 111 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
115-93-422-41-003000
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1,488
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-99-422-41-001000
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1,502
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS TINLEAD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-99-322-41-001000
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1,832
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS TINLEAD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,120
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,059
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-322-41-801000
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1,735
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame, Decoupling Capacitor DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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732
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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861
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,887
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 614 Active Tube -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,626
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 614 Active Tube -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,264
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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838
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,329
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-91-422-41-001000
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606
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-91-322-41-001000
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1,551
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-422-41-001000
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1,442
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
101-93-422-41-560000
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2,201
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 101 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,623
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 22POS GOLD 500 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) 22 (2 x 11) Beryllium Copper 25.0µin (0.63µm) Brass, Copper
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3,114
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 22POS GOLD 800 Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) 22 (2 x 11) Copper Alloy 80.0µin (2.03µm) Copper Alloy