Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
Default Photo
RFQ
VIEW
RFQ
2,762
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 126 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
1,833
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 126 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
2,632
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 124 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
3,680
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 124 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
2,849
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 612 Active Tube -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
2,898
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 612 Active Tube -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
668
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
1,522
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
2,548
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
716
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
1,550
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
2,319
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 126 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
956
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 126 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
939
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
1,081
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
2,832
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 605 Active Tube -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
3,127
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 146 Active Tube -55°C ~ 125°C Through Hole Press-Fit Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
3,847
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 101 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
2,455
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
2,915
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 614 Active Tube -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-320-41-605000
RFQ
VIEW
RFQ
3,977
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
1,133
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 111 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
2,220
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 146 Active Tube -55°C ~ 125°C Through Hole Press-Fit Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
1,595
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 126 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
2,452
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 126 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
3,304
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
1,142
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
2,756
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
756
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
123-93-320-41-001000
RFQ
VIEW
RFQ
1,187
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy