- Part Status :
- Operating Temperature :
- Contact Finish - Mating :
- Contact Finish Thickness - Mating :
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42 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
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VIEW |
3,122
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 20 (2 x 10) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
|
VIEW |
1,989
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 20 (2 x 10) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
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VIEW |
1,214
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 20 (2 x 10) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
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VIEW |
3,453
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 20 (2 x 10) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
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|
VIEW |
2,582
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Tin | - | Tin | 20 (2 x 10) | Beryllium Copper | - | Beryllium Copper | |||
|
VIEW |
863
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 20 (2 x 10) | Phosphor Bronze | - | Phosphor Bronze | |||
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|
VIEW |
2,050
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 20 (2 x 10) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
|
VIEW |
2,759
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 20 (2 x 10) | Phosphor Bronze | - | Phosphor Bronze | |||
|
VIEW |
3,988
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Tin | - | Tin | 20 (2 x 10) | Phosphor Bronze | - | Phosphor Bronze | |||
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|
VIEW |
668
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | - | Active | Tube | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | - | 20 (2 x 10) | Beryllium Copper | - | Brass | |||
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|
VIEW |
3,787
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 20 (2 x 10) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
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|
VIEW |
1,701
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 20 (2 x 10) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
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|
VIEW |
2,805
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | 500 | Obsolete | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | - | 20 (2 x 10) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,295
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 20POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
VIEW |
973
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 20POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
VIEW |
760
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Gold | 20 (2 x 10) | Beryllium Copper | 25.0µin (0.63µm) | Beryllium Copper | |||
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VIEW |
3,628
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 20POS GOLD | 210 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 20 (2 x 10) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
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|
VIEW |
2,337
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS TINLEAD | 500 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Tin-Lead | - | - | 20 (2 x 10) | Beryllium Copper | - | Brass | |||
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|
VIEW |
1,404
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS TIN | 500 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin | - | Tin | 20 (2 x 10) | Beryllium Copper | - | Nickel | |||
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|
VIEW |
2,920
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 20POS TINLEAD | 210 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Tin-Lead | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
3,365
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS TIN | Diplomate DL | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 20 (2 x 10) | Beryllium Copper | - | Beryllium Copper | |||
|
VIEW |
1,002
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 20POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 20 (2 x 10) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,677
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 20POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
3,440
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 20POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 20 (2 x 10) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,340
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 20POS TIN | 214 | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
VIEW |
2,084
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 20POS TINLEAD | 214 | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Tin-Lead | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
1,756
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 20POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
VIEW |
3,224
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 20POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
3,238
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Gold | - | Gold | 20 (2 x 10) | Copper Alloy | - | Copper Alloy | |||
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|
VIEW |
3,311
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS TIN | 500 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin | - | Tin | 20 (2 x 10) | Beryllium Copper | - | Beryllium Copper | |||
