Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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2,573
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) - 20 (2 x 10) Copper Alloy - -
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2,337
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS TINLEAD 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Tin-Lead - - 20 (2 x 10) Beryllium Copper - Brass
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1,404
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS TIN 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - Tin 20 (2 x 10) Beryllium Copper - Nickel
2-641264-1
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3,365
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS TIN Diplomate DL Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 20 (2 x 10) Beryllium Copper - Beryllium Copper
820-AG11D-ESL-LF
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2,697
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Gold 20 (2 x 10) Beryllium Copper Flash Copper
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3,311
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS TIN 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - Tin 20 (2 x 10) Beryllium Copper - Beryllium Copper
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3,355
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CNC Tech CONN IC DIP SOCKET 20POS GOLD - Active Tube -55°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT) 0.100" (2.54mm) Gold - Tin 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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2,722
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CNC Tech CONN IC DIP SOCKET 20POS GOLD - Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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2,747
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TE Connectivity AMP Connectors DIP SOCKET T/H 20POS 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold - Tin-Lead 20 (2 x 10) Copper Alloy - Copper Alloy
8-1437531-6
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RFQ
2,770
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS TINLEAD 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Tin-Lead - Tin-Lead 20 (2 x 10) Copper Alloy - Copper Alloy
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3,600
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) - 20 (2 x 10) Copper Alloy - -
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601
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 5.00µin (0.127µm) - 20 (2 x 10) Copper Alloy - -
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853
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS TIN 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - Tin 20 (2 x 10) Beryllium Copper - Copper
820-AG11D
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1,611
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 20 (2 x 10) Copper Alloy - Copper Alloy
DILB20P-223TLF
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2,062
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Amphenol FCI CONN IC DIP SOCKET 20POS TIN - Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA), Nylon 0.100" (2.54mm) Tin 100.0µin (2.54µm) Tin 20 (2 x 10) Copper Alloy 100.0µin (2.54µm) Copper Alloy